Flame Resistance Thermal ConductiveTwo-Part Silicone Potting
Compound And Encapsulants For Electronics
Product Description
Silicone potting compounds and encapsulants provide a flexible,
protective barrier or enclosure against a variety of environmental
factors for electronic circuits and systems. These silicones are
used when a deep section cure is required and prevent, debris, heat
shock and vibration from damaging the electronics.
In addition to protecting electronic components, silicone potting
compounds and encapsulants are used for other functionalities that
may be required such as thermal transfer and light emission.
Features:
· Two-component addition type silicone potting compound.
· Mix ratio is 1:1
· Low hardening shrinkage.
· Excellent high temperature electrical insulation and high
stability.
· Good waterproof and moisture-proof.
· Excellent flame retardant.
Applications:
· Automotive electronics, modules.
· LED power driver module.
· Solar module junction box.
· Electric vehicle charging column module.
· Lithium battery and capacitor bank.
· Magnetic induction coil
· power inverters
Technical datasheet of Electronic Potting Silicone Compound& Encapsulates
| Item No. | RTV160 |
| Before curing |
| Appearance | A: brick red B: transparent |
| Viscosity (mPa.s 25°C) | 3000~6000 |
| Density (g/cm3 ) | 1.57±0.02 |
| Working life (min 25°C) | 30 |
| Curing time (hrs) | 24 |
| Heat-up at 100°C (min) | 10 |
| After curing |
| Hardness (shore A) | 50~60 |
| Dielectric breakdown voltage kv/mm 25°C | ≥20 |
| Volume resistivity ohm*cm | 1*1015 |
| Tensile Strength Mpa | ≥0.6 |
| Thermal conductivity cm/°C | 0.525*10-3 |
| Working temperature °C | -30~200 |
Note: Mechanical and electrical performance data tested at 25°C 7
days after curing, relative humidity of 55%; all the tested data is
average value.
PREPARING SURFACES
In applications requiring adhesion, priming will be required for
many of the silicone encapsulants. For best results, the primer
should be applied in a very thin, uniform coating and then wiped
off after application. After application, it should be thoroughly
cured prior to application of the silicone encapsulant.
PROCESSING/CURING
Thoroughly mixed silicone encapsulants may be poured/dispensed
directly into the container in which it is to be cured. Care should
be taken to minimize air entrapment. When practical,
pouring/dispensing should be done under vacuum, particularly if the
component being potted or encapsulated has many small voids. If
this technique cannot be used, the unit should be evacuated after
the silicone encapsulant has been poured/ dispensed. MC silicone
encapsulants may be either room temperature (25 °C/77 °F) or heat
cured.
Packaging of Electronic Potting Silicone Encapsulates
Packs are available in 20kg and 200kg per drum.
Storage & Transportation of Electronic Potting Silicone Encapsulates
USABLE LIFE AND STORAGE
Shelf life has 12 months after the production date.
Containers should be kept tightly closed and head or air space
minimized. Partially filled containers should be purged with dry
air or other gases, such as nitrogen. Exposure to moisture could
reduce adhesion and cause bubbles to form.
