Good Flowability Flame Resistance Waterproof 1 To 1 Mix Silicone
Encapsulation & Potting For Electronics
Product Description
MC Silicones delivers a wide variety of silicone-based polymers for
diverse solutions in electric, electronic and energy application
cases. Silicone encapsulants are protective materials used to
completely embed electronic circuitry. Typically, they are used to
protect circuits from harmful effects of moisture and other
contaminants, provide electrical insulation for high voltages and
also protect the circuit and interconnections from thermal and
mechanical stress.
Features
• Good flowability
• Room temperature or heat accelerated cure
• Moderate thermal conductivity
• UL 94V-0
Benefits
• Rapid, versatile cure processing controlled by temperature
• Can be considered for uses requiring added flame resistance
Composition
• White and Black/Dark Grey
• 1 to 1 Mix Ratio
• Polydimethylsiloxane
Technical datasheet of Electronic Potting Silicone Compound& Encapsulates
| Item No. | RTV160 |
| Before curing |
| Appearance | A: brick red B: transparent |
| Viscosity (mPa.s 25°C) | 3000~6000 |
| Density (g/cm3 ) | 1.57±0.02 |
| Working life (min 25°C) | 30 |
| Curing time (hrs) | 24 |
| Heat-up at 100°C (min) | 10 |
| After curing |
| Hardness (shore A) | 50~60 |
| Dielectric breakdown voltage kv/mm 25°C | ≥20 |
| Volume resistivity ohm*cm | 1*1015 |
| Tensile Strength Mpa | ≥0.6 |
| Thermal conductivity cm/°C | 0.525*10-3 |
| Working temperature °C | -30~200 |
Note: Mechanical and electrical performance data tested at 25°C 7
days after curing, relative humidity of 55%; all the tested data is
average value.
PREPARING SURFACES
In applications requiring adhesion, priming will be required for
many of the silicone encapsulants. For best results, the primer
should be applied in a very thin, uniform coating and then wiped
off after application. After application, it should be thoroughly
cured prior to application of the silicone encapsulant.
PROCESSING/CURING
Thoroughly mixed silicone encapsulants may be poured/dispensed
directly into the container in which it is to be cured. Care should
be taken to minimize air entrapment. When practical,
pouring/dispensing should be done under vacuum, particularly if the
component being potted or encapsulated has many small voids. If
this technique cannot be used, the unit should be evacuated after
the silicone encapsulant has been poured/ dispensed. MC silicone
encapsulants may be either room temperature (25 °C/77 °F) or heat
cured.
POT LIFE AND CURE RATE
Cure reaction begins with the mixing process. Initially, cure is
evidenced by a gradual increase in viscosity, followed by gelation
and conversion to a solid elastomer. Pot life is defined as the
time required for viscosity to double after Parts A and B (base and
curing agent) are mixed and is highly temperature and application
dependent. Please refer to the data table.
Packaging of Electronic Potting Silicone Encapsulates
Packs are available in 20kg and 200kg per drum.
Storage & Transportation of Electronic Potting Silicone Encapsulates
USABLE LIFE AND STORAGE
Shelf life has 12 months after the production date.
Containers should be kept tightly closed and head or air space
minimized. Partially filled containers should be purged with dry
air or other gases, such as nitrogen. Exposure to moisture could
reduce adhesion and cause bubbles to form.
