Programmable Quick Change Temperature Stability Test Chamber
iqualitrol QTH-225KD Microprocessor Control
Brief Introduction:
Depending on whether the test product is a live load, a larger
chamber may be needed to dissipate heat produced by the test
subject, adversely affecting the chamber’s pull-down times or
humidity system.
More active live load products produce their own energy resulting
in a larger amount of heat, therefore, will require bigger
refrigeration systems to cool the product to your specifications.
In the same manner, heavier and denser dead load products require
larger refrigeration and heating systems in order to achieve
desired ramp-up and pull-down rates.
Rapid change temperature testing specifies a test sample
temperature variation rate of 15°C/minute or less, which is the
biggest difference between this method and thermal shock testing.
Since rapid change temperature testing achieves highly repeatable
test results, it is used for compliance testing for standards such
as JEDEC (JESD 22-A104B).
With the ongoing rise in issues affecting the reliability of
electronic devices and circuit boards, a better-suited evaluation
testing method is needed to respond to issues such as higher device
operation temperatures resulting from greater semiconductor
integration, changes in device mounting methods such as BGA and
CSP, and the use of lead-free solder.
Rapid change temperature testing is a type of thermal cycling tests
developed to improve the failure repeatability of thermal shock
tests.
Features:
1, Available internal chamber volumes: 150L, 225L, 416L, 800L and
1000L;
2, To preset different heating and cooling rate: 5℃/min, 10℃/min,
15℃/min;
3, Support rapid change temperature test, condensation test, high
temperature/humidity test, temperature/humidity loop test, etc.
4, Complete real time curve display;
5, Conform but not limited standards: MIL-STD-2164, MIL-344A-4-16,
GJB-1032-90, GJB/Z34-5.1.6, etc.
Technical Specifications:
| Model | Temp Range | Internal Dimension(mm) | Exterior Dimension (mm) |
| QTH-150KB | -20℃～﹢150℃ | 500 x 600 x 500 | 800 x 1450 x 1120 |
| QTH-225KB | 500 x 750 x 600 | 800 x 1620 x 1320 |
| QTH-416KB | 700 x 850 x 700 | 980 x 1860 x 1600 |
| QTH-800KB | 1000 x 1000 x 800 | 1350 x 1980 x 1700 |
| QTH-1000KB | 1000 x 1000 x 1000 | 1350 x 1980 x 1800 |
| QTH-150KC | -40℃～﹢150℃ | 500 x 600 x 500 | 800 x 1450 x 1120 |
| QTH-225KC | 500 x 750 x 600 | 800 x 1620 x 1320 |
| QTH-416KC | 700 x 850 x 700 | 980 x 1860 x 1600 |
| QTH-800KC | 1000 x 1000 x 800 | 1350 x 1980 x 1700 |
| QTH-1000KC | 1000 x 1000 x 1000 | 1350 x 1980 x 1800 |
| QTH-150KD | -70℃～﹢150℃ | 500 x 600 x 500 | 800 x 1450 x 1120 |
| QTH-225KD | 500 x 750 x 600 | 800 x 1620 x 1320 |
| QTH-416KD | 700 x 850 x 700 | 980 x 1860 x 1600 |
| QTH-800KD | 1000 x 1000 x 800 | 1350 x 1980 x 1700 |
| QTH-1000KD | 1000 x 1000 x 1000 | 1350 x 1980 x 1800 |
| Temperature fluctuation | ±0.5℃ |
| Temperature uniformity | ±2.0℃ |
| Heating/Cooling Rate | 3℃/min, 5℃/min, 10℃/min, 15℃/min, 20℃/min (optional) |
| Temperature slope | Linearity or Average |
| Control system | Large LCD touch screen controller, data can be displayed directly |
| Inner materials | SUS#304 Stainless steel |
| Outer materials | Cold rolled steel sheet powder baking paint |
| Insulation material | Rigid polyurethane foam |
| Cooling mode | 1, Cooling system (No consumables, suitable for long-term high
frequency test) 2, Liquid nitrogen assist in cooling (Liquid nitrogen is a material
used for short and low frequency test) |
| Safety devices | Electric leakage protection , Short circuit protection, Overheat
protection ,Water shortage protection , Dry burn protection switch
alarm device |
| Power Supply | AC220/380V, 50/60HZ, |
| Note | 1, The performance values are no specimen inside the test area.
2, At 20ºC ambient temperature, relative humidity 65%RH, rated
voltage |
