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Low Compression Thermally Conductive Putty Thermal Gel 3.5W/MK For Vihicel Enginee Controller Cooling

    Buy cheap Low Compression Thermally Conductive Putty Thermal Gel 3.5W/MK For Vihicel Enginee Controller Cooling from wholesalers
     
    Buy cheap Low Compression Thermally Conductive Putty Thermal Gel 3.5W/MK For Vihicel Enginee Controller Cooling from wholesalers
    • Buy cheap Low Compression Thermally Conductive Putty Thermal Gel 3.5W/MK For Vihicel Enginee Controller Cooling from wholesalers
    • Buy cheap Low Compression Thermally Conductive Putty Thermal Gel 3.5W/MK For Vihicel Enginee Controller Cooling from wholesalers

    Low Compression Thermally Conductive Putty Thermal Gel 3.5W/MK For Vihicel Enginee Controller Cooling

    Ask Lasest Price
    Brand Name : ZIITEK
    Model Number : TIF035-05
    Certification : UL and RoHs
    Price : negotiation
    Supply Ability : 10000/day
    Delivery Time : 3-5work days
    • Product Details
    • Company Profile

    Low Compression Thermally Conductive Putty Thermal Gel 3.5W/MK For Vihicel Enginee Controller Cooling

    Low Compression Thermally Conductive Putty Thermal Gel 3.5W/MK For Vihicel Enginee Controller Cooling

    TIF®035-05 is a soft silicone gel-based gap filer pad, formulated with a special blend of filers to provide both excellent thermal conductivity and superior softness. Compared to conventional thermal greases, TIF®035-05 has a higher viscosity, which effectively prevents filler separation from the silicone matrix and reduces filler migration, helping maintain consistent thermal performance. It is applied in a similar manner to thermal grease and is suitable for commercial dispensing or automated equipment. Typical applications include flip-chip microprocessors, PPGAs, micro BGA packages, BGA packages, DSP chips, circular Isilicon chips, LED lighting, and other high-power electronic components.


    Feature

    >Thermal conductivity: 3.0 W/mK
    >Soft, very low compression
    >Low thermal impedance
    >Operate automatically
    >Proven long-term reliability

    Application

    >Heat-sink & frame
    >LED backlight module,LED lighting
    >High speed hardware driver
    >Micro heat pipe
    >Vihicel enginee controller
    >Telecom industry
    >Semiconductor automatic laboratory equipment


    TIF®035-05​ Typical Properties
    PropertyValueTest method
    ColorBlueVisual
    Construction & CompositionCeramic filled silicon material-
    Flow Rate(g/min)30Ziitek Test Method (30 cc syringe/ 2.5 mm orifice/ 90 psi)
    Density(g/cc)3.25g/cASTM D297
    Thermal conductivity3.5W/mKASTM D5470
    Thermal Impedance @10psi (℃.in²w)0.08ASTM D5470
    Thermal Impedance @50psi (℃.in²w)0.075ASTM D5470
    Recommended Operating Temp-45 ~200°CZiitek Test Method
    Dielectric Strength(V/mm)≥4000ASTM D149
    Bond Line Thickness(mm)0.1Ziitek Test Mothod
    Flame RatingV-0UL 94
    Shelf Life12 months-

    Product Specification:

    30 cc/pcs, 98 pcs/box; 300 cc/pcs, 6 pcs/box.
    Custom packaging available for automation use. Please contact us for confirming.
    If you want to know our thermal products, please visit our website.

    Company Profile


    Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

    Ziitek Culture


    Quality :

    Do it right the first time, total quality control

    Effectiveness:

    Work precisely and thoroughly for effectiveness

    Service:

    Quick response, On time delivery and Excellent service

    Team work:

    Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

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