Thickness 0.035mm (35 μm,1 OZ ) single side gray treated Rolled
Copper foil For CCL Epoxy board
Single side treatment low profile foil in gray.
Quickly details
Thickness: 0.0350mm
Width: 10-520mm
Length: 500-5000 M
Temper: H
Features:
. Lamellar crystal structure of rolled copper foil leads to high
flexibility
. Excellent etching performance
. Single side treatment low profile enables to make fine circuit
pattern
Application:
Copper Clad Laminate(CCL), Printed Circuit board(PCB)
· CEM-3
· Auto
· IC Substrate
· High Speed Circuit Material
FAQ:
Q1: If provide sample test ?
A: We can supply samples to check the quality before bulk order.
But the price will be sample price not wholesale price.
Q2. Do you test all your goods before delivery?
A: Yes, we have 100% test before delivery.
Q3. what is your standard width?
A: 520mm and 620mm,we accept customization for the width. we can
cut it into any size that you demand after pass discussing.
Copper foil technical sheet (All size )for PCB,CCL
| Thickness | 0.009-0.09mm | Width≤520mm |
| Item | Unit | Parameter |
| Thickness | MM | 0.009 | 0.012 | 0.018 | 0.035 | 0.07 | 0.1 |
| Grade | － | C1100 | C1100 | C1100 | C1100 | C1100 | C1100 |
| Copper content | % | ≥99.95 | ≥99.95 | ≥99.95 | ≥99.95 | ≥99.95 | ≥99.95 |
| Area Weight | g/㎡ | 80±2 | 107±4 | 160±5 | 311±10 | 623±19 | 890±27 |
| Roughness | (RA) | Um | ≤0.2 | ≤0.2 | ≤0.2 | ≤0.2 | ≤0.2 | ≤0.2 |
| Tensile Strength(MP) | State normal | Mpa | ≥380 | ≥400 | ≥400 | ≥420 | ≥430 | ≥450 |
| State temper (180℃) | Mpa | ≥160 | ≥160 | ≥160 | ≥170 | ≥180 | ≥190 |
| Elongation(%) | State normal | % | ≥0.8 | ≥1.0 | ≥1.2 | ≥1.3 | ≥1.4 | ≥1.5 |
| State temper(180℃) | % | ≥5 | ≥6 | ≥8 | ≥15 | ≥20 | ≥25 |
| Peel strength | N/mm | ≥0.8 | ≥1.0 | ≥1.4 | ≥1.5 | ≥1.8 | ≥2.0 |
| High temperature oxidation resistance(180℃ 1hour) | － | Qualified | Qualified | Qualified | Qualified | Qualified | Qualified |
Remark: we accept customization and RD new product from your
demand.
The testing of peel strength use FR-4(Tg140℃) and FR-4(Tg170℃)
prepreg.
