Copper Film Multilayer PCB Printed Circuit Board Light Weight LED
Embedded
Quick Detail:
Name | FPCB | Material | Cu: 1 oz PI: 1 mil |
Color | Transparent,red,yellow, green,blue.Pink.,purple | Surface treatment | pure-tin plating |
Minimum hole dimension | 0.3mm | Chemical resistance | Meet IPC standard: |
Minimum linear width | 0.08mm | Minimum linear distance | 0.08mm |
External tolerance | +/-0.05mm | Welding resistance | 280 more than 10 seconds |
Peeling Strength | 1.2kg/cm2 | Heat resistance | -200 to +300 degrees C |
Surface resistivity | 1.0*1011 | Bandability: | Meet IPC standard |
Description:
The main technical indicators
1. Max size: single sided, double sided:600mm * 500mm Multi-layer:
400mm * 600mm
2. Processing thickness:0.2mm -4.0mm
3 Copper foil substrate thickness: 18μ(1/ 2OZ ),35μ( 1OZ ),70μ( 2OZ
)
4 Common material: FR-4 , CEM-3 , CEM-1,
Polytetrachloroethylene,FR-1(94V0,94HB)
5. Light copper,Nickel-plated,Gilded,HAL；Immersion
Gold,Antioxidant,HASL,Immersion Tin,etc.
Applications:
Products are widely used in :
Communication, industrial control, household appliances, GPS,
children’s kid-learning, electronic reading
machine, various game machines, Instruments and Apparatuses,
attendance machine,
Electronic scale, medical equipment, electronic tools equipment,
automatic sewing machine,
Embroidery Machine, Machine Maintenance equipment, computer
keyboard and electronic calculators etc.
Remote control, control board for home appliances,medical equipment
,auto,computer and cell phone etc.
The latest applications
Hard disk drives (HDDS, hard disk drive) of suspended circuit (Su
ensi. N cireuit) and the components of packaging board, etc
Company Advantage:
1) Top managers are experienced in the same field for many years.
2) Professional staff and workers.
3) Strong R&D capability
4) Quick Delivery
5) Competitive price
6) Two factories are available for large orders
7) Expert sales team and good customer service.
Specifications
Type | PCB | Application | Electronic Products |
Color | blue | Feature | Energy-efficient & Low power |
Machine Stiffness | Rigid | Lays
| Customized |
Material | PET /PC | I nsulation Material | Organic resin |
I nsulation layer thichness | General | Antiflaming Speciality | VO |
Processing Technic | Rolled foil | Reinforcing material | Glass fiber |
Insulating Resin | Polyimide resin | Export Markets | Global |
Process Capability
1. Drilling:The minimum diameter 0.1mm
2. Hole metallization:Minimum aperture 0.2mm,Thickness / aperture
ratio 4:1
3. Wire width: Minimum:Gold plate 0.10mm, Tin plate0.1mm
4. Wire spacing: Minimum:Gold plate 0.10mm, Tin plate0.1mm
5. Gold plate: nickel layer thickness:≧2.5μ,Gold layer thickness:
0.05-0.1μm or according to customer requirements
6. HASL: tin layer thickness:≧2.5-5μ
7. Paneling: Line-to-edge minimum distance: 0.15mm hole to edge
minimum distance: 0.15mm smallest form tolerance: ± 0.1mm
