Electronics Rigid Flexible Printed Circuit Board for Telephone
System
Quick Detail:
Name | FPCB | Material | Cu: 1 oz PI: 1 mil |
Color | Transparent,red,yellow, green,blue.Pink.,purple | Surface treatment | pure-tin plating |
Minimum hole dimension | 0.3mm | Chemical resistance | Meet IPC standard: |
Minimum linear width | 0.08mm | Minimum linear distance | 0.08mm |
External tolerance | +/-0.05mm | Welding resistance | 280 more than 10 seconds |
Peeling Strength | 1.2kg/cm2 | Heat resistance | -200 to +300 degrees C |
Surface resistivity | 1.0*1011 | Bandability: | Meet IPC standard |
Description:
The main technical indicators
1. Max size: single sided, double sided:600mm * 500mm Multi-layer:
400mm * 600mm
2. Processing thickness:0.2mm -4.0mm
3 Copper foil substrate thickness: 18μ(1/ 2OZ ),35μ( 1OZ ),70μ( 2OZ
)
4 Common material: FR-4 , CEM-3 , CEM-1,
Polytetrachloroethylene,FR-1(94V0,94HB)
5. Light copper,Nickel-plated,Gilded,HAL；Immersion
Gold,Antioxidant,HASL,Immersion Tin,etc.
Applications:
Our membrane switches are widely used in :
1.Medical Equipment
2.Telecommunications apparatus
3.Telephone systems
4.Household appliances
5.Security systems
6.Point of sale apparatus
7.Industrial controls
8.Access control systems.....
Company Advantage:
1) Top managers are experienced in the same field for many years.
2) Professional staff and workers.
3) Strong R&D capability
4) Quick Delivery
5) Competitive price
6) Two factories are available for large orders
7) Expert sales team and good customer service.
Specifications
Type | PCB | Application | Electronic Products |
Color | blue | Feature | Energy-efficient & Low power |
Machine Stiffness | Rigid | Lays | Customized |
Material | PET /PC | I nsulation Material | Organic resin |
I nsulation layer thichness | General | Antiflaming Speciality | VO |
Processing Technic | Rolled foil | Reinforcing material | Glass fiber |
Insulating Resin | Polyimide resin | Export Markets | Global |
Process Capability
1. Drilling:The minimum diameter 0.1mm
2. Hole metallization:Minimum aperture 0.2mm,Thickness / aperture
ratio 4:1
3. Wire width: Minimum:Gold plate 0.10mm, Tin plate0.1mm
4. Wire spacing: Minimum:Gold plate 0.10mm, Tin plate0.1mm
5. Gold plate: nickel layer thickness:≧2.5μ,Gold layer thickness:
0.05-0.1μm or according to customer requirements
6. HASL: tin layer thickness:≧2.5-5μ
7. Paneling: Line-to-edge minimum distance: 0.15mm hole to edge
minimum distance: 0.15mm smallest form tolerance: ± 0.1mm
8. Socket chamfer: Angle: 30 degrees, 45 degrees, 60 degrees Depth:
1-3mm
9. V Cut: Angle: 30 degrees, 35 degrees, 45 degrees Depth:
thickness 2/3 Minimum size: 80mm * 80mm
