Inductor End Electrode Silver Paste For Component Termination

Product Introduction

Silver termination paste is a foundational material for the formation of external inductor electrodes. Formulated from high-purity silver powder, glass frit, and a specialized organic vehicle, it is applied via precision dipping or screen-printing methodologies. Following low-temperature sintering, it develops a highly densified electrode layer that ensures a robust interface between internal coils and external circuitry, providing the necessary resilience for subsequent Ni/Sn electroplating processes.

Core Advantages

● Strong Adhesion

The use of composite flake glass powder technology promotes the sinking of the glass phase and the embedding of the silver layer after sintering, significantly enhancing the bonding strength between the electrode and the magnetic core.

● Excellent Solderability

The electrode layer is dense and smooth, with good compatibility with nickel/tin plating processes, ensuring the reliability of SMT mounting.

● Low Cost and Environmental Friendliness

By optimizing the silver powder particle size ratio (e.g., combining micron/submicron silver powders), high performance can be maintained with silver content below 60%, supporting a "no-plating" process that reduces electroplating pollution.

● Process Adaptability

Viscosity is controllable (e.g., 39±6 Pa·s), suitable for various coating methods such as dipping and screen printing.

Application Areas

Specifically used for forming end electrodes in chip inductors, magnetic beads, and LTCC modules, it is a key material for the termination of chip components in consumer electronics, networking devices, and automotive electronics.

Sputtering Targets for PVD Thin-Film Deposition

APG manufactures metal, alloy, ceramic and rare earth sputtering targets for industrial PVD applications. Explore materials for semiconductor, photovoltaic, optical coating, display and Low-E glass applications.

Browse sputtering target materials, metal and alloy sputtering targets, ceramic sputtering targets and rare earth sputtering targets. APG also provides target bonding and backing plate services.

For a quotation, specify the material or composition, required purity, target shape and dimensions, quantity, backing plate and bonding requirements. Include a drawing and your deposition application where available. Contact APG about your sputtering target requirements.

About APG

Shenzhen APG Material Company Limited (APG), headquartered in Shenzhen, China, currently operates three factories located in Shenzhen, Changzhou, and Changsha, and employs more than 200 people.

APG specializes in the research and development (R&D) and production of PVD materials (sputtering targets and evaporation materials), pastes, and powders. These products serve industries such as PV solar cells, optics, semiconductors, smart touch and display manufacturing, Low-E glass production, permanent magnets, power batteries, and decorative and functional coating applications.

APG utilizes leading production technologies, including sintering, plasma spraying, and melting. The company produces ceramic materials, compound materials, metals, and alloy materials, and also provides bonding and backing plate services. APG possesses the necessary technology and equipment to produce both powder and pastes.

APG maintains a strong technical team and R&D department, which accounts for more than 20% of the company's total employees. This team focuses on developing new materials and technologies and holds numerous patents. Additionally, APG operates an inspection center equipped with various instruments to guarantee the stable quality of all products. APG is committed to the research, development, and production of high-performance materials and delivering excellent service to its customers.