This 2-layer rigid PCB is built with Astra MT77—an advanced
low-loss dielectric material—optimized for millimeter-wave and
RF/microwave commercial applications.
PCB Specifications
| Parameter | Specification |
| Layer Count | 2-layer rigid PCB |
| Base Material | Astra MT77 |
| Board Dimensions | 48.5mm x 43.3mm (1 piece), tolerance ±0.15mm |
| Finished Board Thickness | 0.33mm |
| Finished Copper Weight | 1oz (1.4 mils / 35μm) |
| Via Plating Thickness | 20μm |
| Minimum Trace/Space | 4 mils / 4 mils |
| Minimum Hole Size | 0.2mm |
| Vias | 21 total (no blind vias) |
| Surface Finish | Immersion Gold |
| Silkscreen | Top: White; Bottom: No |
| Solder Mask | Top: Green; Bottom: Green |
| Quality Assurance | 100% Electrical test prior to shipment |
| Accepted Standard | IPC-Class-2 |
| Availability | Worldwide |
PCB Stack-up (Top to Bottom)
| Layer Sequence | Layer Type | Specification | Thickness |
| 1 | Copper Layer (Top - L1) | Copper_layer_1 | 35μm (1oz) |
| 2 | Base Material | Astra MT77 | 0.254mm (10mil) |
| 3 | Copper Layer (Bottom - L2) | Copper_layer_2 | 35μm (1oz) |
Astra MT77 Material Overview
Astra MT77 is a breakthrough dielectric material designed for
millimeter-wave frequencies and beyond. It delivers exceptional
electrical performance that remains stable across a broad frequency
range and temperatures (-40°C to +140°C), even up to W-band
frequencies. As a cost-effective alternative to PTFE and other
commercial microwave laminates, it meets the demands of modern
commercial RF/microwave printed circuit designs while offering
ultra-low loss and reliable performance.
Key Features of Astra MT77
| Property | Specification |
| Dielectric Constant (Dk) | 3.0 (2GHz/23°C; 10GHz/23°C) |
| Dissipation Factor (Df) | 0.0017 (2GHz; 10GHz) |
| Peel Strength (1oz Copper) | 5.7 lb/inch |
| Moisture Absorption | 0.1% |
| Coefficient of Thermal Expansion (CTE) | X-axis: 12 ppm/°C; Y-axis: 12 ppm/°C; Z-axis: 250–350 ppm/°C |
| Glass Transition Temperature (Tg) | 200°C (DSC method) |
| Flammability Rating | UL 94-V0 |
| Process Compatibility | Lead-free compatible |
Processing Advantages
Astra MT77 simplifies manufacturing with multiple practical
benefits:
-Compatible with standard FR-4 processing workflows (no special
equipment needed)
-Short lamination cycles for improved production efficiency
-Reduced drill wear to lower manufacturing costs
-No plasma desmear required, streamlining processing steps
-Good flow and fill characteristics for reliable layer adhesion
-Strong dimensional stability across production and operating
conditions
-Supports multiple lamination cycles for flexible manufacturing
-Compatible with any layer technology, HDI, and VIPPO designs
Typical Applications
This 2-layer Astra MT77 PCB is specifically tailored for automotive
-RF/microwave systems, including:
-Long-range antennas and radar for adaptive cruise control
-Pre-crash detection systems
-Blind spot monitoring
-Lane departure warning systems
-Stop-and-go systems
