Our PCIe 3.0 to 6.0 series connectors deliver ultra-high
transmission rates up to 64 GT/s, ensuring superior signal
integrity and stable performance for high-speed computing. Designed
with high reliability, durability, and hot-plug capability, each
connector undergoes rigorous testing in our automated production
lines to guarantee consistent quality. We provide comprehensive
OEM/ODM customization, covering both board-end and cable-end
solutions. Widely used in AI servers, data centers, GPU
accelerators, and industrial automation, our PCIe connectors enable
secure, efficient, and high-bandwidth interconnections for
next-generation systems. ShuangYi Precision — Powering Smarter
Connections.
ShuangYi Precision — Powering Smarter Connections.
Why Choose Us:
• Free samples available for quality evaluation.
• Support for both OEM & ODM customization.
• Trade Terms: EXW, FOB, CIF, CPT, etc.
Notice: The displayed price is only for reference. Contact us now for the
best offer and detailed quotation!
This SAS4/PCIe 68-Pin SMT Female Connector is designed for next-generation high-speed data transmission
systems, supporting SAS 4.0 and PCIe bandwidth requirements.
It features 30µ" gold-plated contact terminals, nickel underplating, and 100µ" matte-tin solder areas, ensuring exceptional conductivity, corrosion resistance, and
long-term durability.
The connector uses UL94-V0 LCP housing and high-strength C5191 phosphor bronze terminals, providing superior mechanical stability and reliability under
high-frequency, high-signal-integrity environments.
Thanks to its SMT surface-mount design, it is optimized for
automated PCB assembly and compact high-density layouts.
With a wide operating temperature range, strong mechanical
endurance, and compliance with RoHS 2.0 & Halogen-Free standards, this connector is ideal for server-level storage
devices, automotive electronics, and industrial systems requiring
stable high-speed signal transmission.
| Product Type | SAS4 / PCIe 68-Pin SMT Female Connector |
| Compatibility | SAS 4.0 / PCIe High-Speed Interfaces |
| Contact Area Plating | 30µ" Gold (Au) |
| Nickel Underplating | ≥50µ" Ni |
| Solder Area Plating | ≥100µ" Matte Tin |
| Housing Material | LCP, Glass-Fiber Reinforced, Black, UL94-V0 |
| Terminal Material | Phosphor Bronze C5191, t = 0.25 mm |
| Other Metal Parts | Brass C2680, t = 0.30 mm |
| Operating Temperature | –20°C to +85°C |
| Rated Current / Voltage | 1.5A @ 40VAC |
| Contact Resistance | ≤30mΩ |
| Insulation Resistance | ≥1000MΩ |
| Withstand Voltage | 500VAC / 1 minute |
| Mating Force | ≤59N |
| Unmating Force | ≥12N |
| Durability | 500 mating cycles (EIA364-09) |
| Salt Spray (Gold Area) | 48 hours |
| Environmental Compliance | HF + RoHS 2.0 |
| Marking Rules | YYWW (Year + ISO Week), white font |
| Mounting Type | SMT Surface Mount |
| Recommended PCB Pitch | 0.50mm / 0.60mm (per drawing) |
| Plating Measuring Points | Gold/Nickel/Tin check points indicated in drawing |
Key Features
- Supports SAS 4.0 / PCIe High-Speed Transmission
- 30U" Gold-Plated Contacts for improved conductivity and signal integrity
- 100U" Matte Tin Solder Area ensures secure and stable SMT soldering
- UL94-V0 LCP Housing with high heat resistance for reflow soldering
- High Mechanical Reliability with up to 500 mating cycles
- Excellent Resistance to Corrosion and Oxidation
- SMT Design suitable for automated production lines
- Environmental Compliance: HF + RoHS 2.0
- Ideal for High-Frequency / High-Speed PCB Design
⚙️ Applications
1. Server & Storage Equipment
SAS HDD/SSD
RAID expansion cards
Storage backplanes
Data center servers
2. Communication & Networking Devices
Routers and switches
Edge computing devices
Telecom base stations
3. Industrial & Automation Systems
PLC controllers
Industrial IPC motherboards
Motion control modules
4. Automotive Electronics
ADAS data logging
Vehicle storage modules
Smart cockpit controllers
5. High-Density PCB Designs
Compact electronic systems
Multi-board interconnection modules
⚠️ Notes
- Follow reflow soldering temperature suitable for LCP UL94-V0 material.
- Ensure all gold contact areas remain clean and free from oxidation
or oil.
- Maintain ESD protection during handling and assembly.
- PCB layout should strictly follow recommended footprint to avoid
misalignment.
- Avoid excessive mechanical force that could deform terminals.
- Keep products in moisture-proof packaging with desiccant until use.
- Avoid mating with severely oxidized male connectors to prevent
signal loss.
- Store in a dry, temperature-controlled environment to maintain
plating performance.
