Our SAS 3.0/4.0 series connectors deliver exceptional data transfer
speeds of up to 24 Gb/s, ensuring stable and efficient transmission
for enterprise storage and server systems. Designed with high
reliability and hot-plug capability, each connector undergoes
strict quality control and automated precision manufacturing. With
flexible customization options and strong R&D support, our SAS
connectors are ideal for both board-to-board and wire-to-board
applications in enterprise storage systems, servers, and data
centers requiring consistent, high-speed performance. ShuangYi
Precision — Powering Smarter Connections.
ShuangYi Precision — Powering Smarter Connections.
Why Choose Us:
• Free samples available for quality evaluation.
• Support for both OEM & ODM customization.
• Trade Terms: EXW, FOB, CIF, CPT, etc.
Notice: The displayed price is only for reference. Contact us now for the
best offer and detailed quotation!
This SAS 29-Pin SMT Female Connector features a compact, high-density design optimized for SAS
high-speed signal transmission.
It uses Gold Flash (G/F) plating on the contact area with ≥50u" nickel underplating, ensuring stable conductivity, corrosion resistance, and long-term
durability for data-intensive applications.
The connector is built with UL94-V0 flame-retardant LCP housing and C2680-EH brass terminals, offering superior mechanical strength and excellent performance
during SMT reflow soldering.
With low contact resistance (≤30mΩ), high insulation resistance,
and up to 500 mating cycles, it is ideal for servers, storage devices, industrial equipment,
and automotive electronics.
| Product Type | SAS 29-Pin SMT Female Connector (G/F Gold Flash Plating) |
| Housing Material | LCP, Glass-Fiber Reinforced, Black, UL94-V0 |
| Terminal Material | Brass C2680-EH, t = 0.30 mm |
| Plating – Nickel | ≥ 50u" Nickel on contact area |
| Plating – Gold Flash (G/F) | Gold Flash (G/F) on contact area |
| Plating – Matte Tin | ≥ 80u" Matte Tin on solder area |
| Peg / Fixing Pin Material | Brass, Ni 50u" Min + Matte Tin |
| Operating Temperature | –20°C to +85°C |
| Rated Current / Voltage | 1.5A @ 40VAC |
| Contact Resistance | ≤ 30mΩ |
| Insulation Resistance | ≥ 1000MΩ |
| Withstand Voltage | 500VAC / 1 minute |
| Insertion Force (Backplane) | ≤25N |
| Unmating Force (Backplane) | ≥5N |
| Terminal Retention Force | ≥0.70 Kgf per pin |
| Fork Retention Force | ≥1.0 Kgf per fork |
| Durability (Mating Cycles) | 500 cycles (per EIA 364-09) |
| Salt Spray Test | 48 hours (Gold area) |
| Environmental Compliance | HF + RoHS 2.0 |
| Marking | YYWW (Year + Week), white font |
| Recommended PCB Layout | 29 pads SMT, fine pitch layout (per drawing) |
| Flatness Requirement | Solder foot flatness must meet tolerance before & after reflow |
Key Features
- Gold Flash (G/F) plated contacts for cost-effective, reliable high-speed signal transmission
- UL94-V0 high-temperature LCP housing, suitable for SMT reflow
- ≥80u" matte tin solder area for robust PCB solder joints
- Precision SMT footprint for high-density PCB layouts
- Low electrical resistance ensuring strong signal and power transmission
- High mechanical retention including 0.70 kgf terminal retention and 1.0 kgf fork retention
- Full compliance with HF + RoHS 2.0 environmental standards
- Ideal for automated SMT assembly lines
- Supports customization (pin pitch, plating thickness, terminal design)
⚙️ Applications
1. Server & Storage Devices
SAS HDD/SSD modules
RAID controller boards
Server backplanes
High-speed data transmission lines
2. Communication Equipment
Network routers and switches
Optical-electrical conversion modules
Edge computing devices
3. Automotive Electronics
ADAS data modules
In-vehicle storage interfaces
ECU signal connectors
4. Industrial Control Systems
PLC controllers
Industrial computers
Data acquisition boards
5. PCB & High-Speed Signal Designs
Multi-board connectivity
Fine-pitch high-density boards
High-speed signal routing applications
⚠️ Notes
- Ensure SMT reflow temperature profile is suitable for LCP UL94-V0
material.
- Keep the gold-flash contact area clean and free from contamination
or oxidation.
- Follow the recommended PCB pad layout to ensure optimal soldering
performance.
- Protect terminals from bending during SMT handling.
- Properly control solder joint flatness before and after reflow to
meet tolerance.
- Maintain ESD protection during assembly to avoid damage.
- Do not mate with oxidized or damaged male connectors to maintain
signal integrity.
- Store in dry, anti-static packaging.
