Custom Geometry Permanent Antistatic Precision Waffle Pack Chip
Trays
This is a highly specialized, customizable waffle pack chip tray,
focusing on applications where component geometry is irregular and
requires maximum protection and precision alignment. While it
adheres to the industry-standard 2-inch and 4-inch footprints, its
core value lies in the tailored, precision-molded pocket design. It
is engineered not just for standard rectangular die, but
specifically for photonic elements, complex optical components, and
semiconductor die with unique or irregular geometries that possess
sensitive surface features (e.g., lenses, terminals, solder balls).
The tray is manufactured from a permanent antistatic/conductive
polymer, ensuring continuous and reliable ESD protection without
relying on temporary surface treatments. Crucially, the tray’s
geometry is optimized through the use of advanced techniques like
Moldflow analysis, guaranteeing an extremely stable size and high
degree of flatness. This stability is essential for processes like
optical inspection where component pitch and coplanarity are
critical. The robust construction and material purity (suitable for
Class 10-1000 cleanrooms) make this waffle pack an ideal, high-end
packaging solution for R&D projects and specialized production
where off-the-shelf carriers simply cannot provide the necessary
component support and feature protection.
Features:
- Precision Pocket Customization
- Permanent Antistatic Protection
- Optimized for Irregular Geometries
- Superior Flatness and Dimensional Stability
- Adaptable to Automation (Chamfers & Tapers)
- Protective Stackable System
Technical Parameters:
| HN24232 Technical Data Ref. |
| Base Information | Material | Color | Matrix QTY | Pocket Size |
| PC | Black | 15*9=135PCS | 3.63*8.63*1.5mm |
| Size | Length * Width * Height (according to customer's requirement) |
| Feature | Durable; Reusable; Rcofriendly; Biodegradable |
| Sample | A. Free Samples – Selected from e×isting products. |
| B. Customized Samples – Produced according to your design or
requirements. |
| Accessory | Cover/Lid, Clip/Clamp, Tyvek paper |
| Artowrk Format | PDF,2D,3D |
Applications:
The primary application for this precision carrier is the secure
and stable handling of optically and structurally complex
microelectronic components. It excels in environments where generic
handling solutions introduce risk. Key applications include:
High-Precision Optical Inspection of lenses or photonic elements,
where the tray’s stability and custom fit ensure the component
remains perfectly aligned; Prototyping and Engineering Lines for
new components with irregular shapes, providing a safe, dedicated
carrier from the earliest R&D stages; Die Sorting and Kitting
of bare die where terminal isolation is required to prevent
electrical shorting; and Safe Global Shipping of extremely fragile
or high-value microelectronics, guaranteeing the product
transportation is secured against crushing and ESD damage. Its
suitability extends beyond semiconductors to managing small,
high-value items in sectors like medical parts, watch parts, and
gems, where custom support and protection are essential.
Customization:
Customization is the foundation of this product offering. We
provide comprehensive engineering support to design a tray that
functions as an extension of your process. This includes: Component
Support Feature Design, where pockets are contoured to support the
device while leaving critical areas exposed or isolated as needed;
Material Selection, allowing choice among various conductive
resins, specific colors for process coding, or specialized
high-temperature plastics; and Physical Specifications, including
options for unique reference marks, color coding, or special tray
thickness beyond the standard specifications.
