Ultra-Inline CT/3D
Equipment Features:
Full 3D automatic imaging and analysis.
Applicable for both on-line inspection and off-line analysis.
Capable of achieving fast CT imaging, with the fastest local
imaging time less than 3 seconds.
Solves the problem of solder joint defect inspection that cannot be
achieved by traditional 2D and 2.5D equipment.
Can be connected to the user's database to directly import
inspection results.
Inspection Applications:
Large-sized PCBA boards
The internal structure quality of semiconductor packaging products.
The welding quality of various types of SMT solder joints, such as
open soldering, wetting conditions, solder volume, offset, foreign
objects, bridging, and the presence of pins.
X-ray Source Parameters Details
| X-ray Tube Type | Closed-tube X-ray source |
| Tube voltage range | 45-130 KV |
| Tube current range | 0-0.5 mA |
| Maximum operating power | 65W |
Equipment Performance Parameters Details
| Maximum possible sample size | 750 mm×530 mm(Length x Width) |
| Maximum imaging area | 730 mm×510 mm(Length x Width) |
| JIMA card resolution | 4μm |
| Equipment weight | 5T |
| Equipment size | 2336 mm×2321 mm×2109 mm(Length
×width×height) |
| Imaging software system |
A set of online plate CT imaging system,
Including integrated scanning,data analysis
and other modules |
Detector parameter
| Detector type | Amorphous silicon flat panel detector |
| Pixel size | 49.8 μm |
| Pixel matrix | 2304×2813 |
Effective imaging
area | 115 mm×140 mm |
| Picture frame rate | 18 fps(1×1) |
