3D X Ray Inspection Equipment For Solder Joint Defects 750mm×530mm

3D X Ray Inspection for Solder Joint Defects - Fast and Accurate Analysis with Ultra-Inline CT/3D Equipment

Detector Parameters

Equipment Performance Parameters

X-ray Source Parameters

• Full 3D automatic imaging and analysis
• Applicable for both on-line inspection and off-line analysis
• Capable of achieving fast CT imaging, with the fastest local imaging time less than 3 seconds
• Solves the problem of solder joint defect inspection that cannot be achieved by traditional 2D and 2.5D equipment
• Can be connected to the user's database to directly import inspection results

• Large-sized PCBA boards
• The internal structure quality of semiconductor packaging products
• The welding quality of various types of SMT solder joints, including open soldering, wetting conditions, solder volume, offset, foreign objects, bridging, and the presence of pins

Wellman, a professional X-Ray inspection manufacturer which is integrates R&D, production and sales that is set up in China by Hong Kong-invested enterprises. 

Wellman has many years of professional R&D team at home and abroad, has been committed to the global intelligent manufacturing equipment industry to provide micro-focus X-ray image detection equipment, casting process detection equipment, lithium battery reliability and safety detection equipment and special non-standard automation equipment one-stop service program.

Our headquarters locates in Shenzhen, since 2003, mainly engaged in automation technology, software technology and big data technology R&D, with more than 30 national patents and software copyright.