Wire Saw Equipment of Vertical/Horizontal/Multi-Wire Cutting for
Sapphire/Ceramics/Marble Materials
The wire saw equipment utilizes a high-speed diamond wire as the
cutting tool, where diamond abrasives are fixed onto a metal wire
via electroplating or resin bonding, forming a flexible cutting
system. Its core value lies in achieving high-precision,
low-damage cutting, significantly improving the processing
efficiency and material utilization of hard and brittle materials
(e.g., sapphire, ceramics, marble), overcoming the limitations of
traditional methods in efficiency and accuracy.
Material Processing Characteristics and Applications
| Material Dimension | Sapphire | Ceramics | Marble |
| Core Characteristics | Ultra-high hardness (Mohs 9), high brittleness | High hardness, high elastic modulus | Non-uniform material, contains hard points like quartz |
| Processing Challenges | Prone to edge chipping and cracks | Cutting surface prone to micro-cracks | Uneven cutting surface and edge chipping |
| Key Metrics | Surface roughness can reach Ra<0.5μm | Pursuit of cutting surface integrity, reducing micro-cracks | High cutting efficiency, good slab flatness |
| Application Directions | LED substrates, optical windows, semiconductor substrates
| Electronic ceramic substrates, packaging materials, structural
ceramics
| Architectural decorative slabs, countertops, carving crafts
|
Working Principle Highlights
The equipment grinds materials through a continuously circulating
diamond wire at high speed, with technical focus varying by
material:
- Sapphire: Requires precise control of parameters like wire speed and tension
to avoid brittle fracture (e.g., 20 m/s wire speed and 50 N tension
can achieve a surface roughness of Ra<0.5μm).
- Ceramics: Relies on the grinding action of the diamond wire to reduce stress
concentration and minimize micro-crack generation.
- Marble: Adapts cutting parameters intelligently to accommodate stone
heterogeneity, ensuring flat cuts.
Processing Methods and Effects
| Material | Block Cutting | Cross Cutting | Multi-Wire Cutting | Effects |
| Sapphire | Narrow kerf (0.55mm), surface roughness <1μm, reduces material
loss | Fast cutting speed, suitable for ingot truncation and shaping | Simultaneous multi-slice cutting enhances efficiency for materials
like silicon wafers |  |
| Ceramics | Neat cutting surface, minimal edge damage, ideal for standard
substrate preparation | Suitable for precision machining of special-shaped components, high
flexibility | High-volume production of uniform components with high efficiency |  |
| Marble | High cutting efficiency, flat slab surface beneficial for
subsequent polishing | Used for block shaping and large slab division | Single cut generates multiple large slabs, suitable for large-scale
projects |  |
Core Parameters
| Parameter | Range/Specification |
| Main Motor Power | 11–75 kW (common models: 22kW, 37kW, 55kW) |
| Wire Speed | 0–40 m/s (high-speed models up to 45 m/s) |
| Maximum Wire Length | 20–150 m (increases with power) |
| Power Supply | Three-phase 380V/50Hz (customizable) |
| Control Method | Automatic/manual, supports CNC or PLC systems |
| Operating Temperature | -15°C ~ +40°C |
Service Commitment
ZMSH provides integrated manufacturing and trading solutions,
covering equipment selection, process optimization, and after-sales
support:
- Customized Design: Configures parameters based on material properties (e.g.,
hardness, size).
- Technical Training: Offers operation and maintenance training to ensure efficient
equipment performance.
- Full-Cycle Service: Provides end-to-end technical support and rapid response from
trial cuts to mass production.
FAQ of Wire Saw Equipment
Q1: How does a wire saw equipment achieve precise cutting?
A1: The equipment uses a high-speed diamond-coated wire that acts
as a flexible grinding tool, abrasively cutting through materials
while maintaining minimal kerf loss and high accuracy due to
controlled tension and linear motion.
Q2: What makes wire saws suitable for environmentally sensitive
operations?
A2: Wire saws eliminate the need for cooling fluids in many cases,
reduce waste generation by up to 80% compared to traditional
methods, and operate with lower noise and energy consumption,
aligning with green manufacturing standards.
Q3: How do wire saws handle complex shapes or large-scale
projects?
A3: With multi-wire configurations, they can simultaneously cut
multiple slices from a single block, enabling efficient processing
of intricate geometries or massive slabs—ideal for architectural
stonework or semiconductor wafer production.
Tags: #Wire Saw Equipment, #Customized,
#Vertical/Horizontal/Multi-Wire Cutting, #Sapphire/Ceramics/Marble
Materials
