PUR Adhesive Glue For Electronics Chemical Resistant
Product Descriptions:
PUR (Polyurethane Reactive) hot melt glue is a specialized adhesive
increasingly used in electronics and phone
Superior bonding strength - forms durable, flexible bonds with various materials
Moisture curing - reacts with ambient humidity to create strong cross-linked bonds
Heat resistance - maintains integrity in high-temperature environments
Chemical resistance - withstands exposure to solvents and other chemicals
Low application temperature (typically 120-140°C) reduces thermal stress on components
manufacturing due to its unique properties.
Characteristics:
BJ1015 showed great and balanced adhesion to PC,ABS, glass, metal
and etc.
BJ1015 strength built-up fast, it reaches 1MPa within 20min after
bonded.
High cured strength:BJ1015 after cured showed high strength on PC
and ABS
both in shear and pulling force.
Re-workable:This product after cured can be re-workable by heat it
to certain
temperature,the glue line shows elasticity properties.
Good work ability : BJ1015W can be applied by extruding bead and
spray.
Good thermos-stability: This product showed termo-stability during
long heat,less
15% increase in viscosity after heated at 110C for 6 hours.
Specification:
| Usage | Electric |
| Color | white |
Elongation ASTM638 | >1000% |
