High-Density Interconnect PCB
HDI PCB (High-Density Interconnect Printed Circuit Board) is a PCB that achieves higher circuit density by using thinner
lines, smaller apertures and denser wiring design. This PCB
technology can achieve more circuit connections in a limited space
by adopting more advanced manufacturing processes and design
technologies, and is widely used in mobile phones, tablets,
computers, equipment, automobiles, electronics and other medical
fields.
Advantages of Miniaturization design PCB:
- Miniaturization design
- Higher circuit density
- Better electrical performance
- Improve heat dissipation performance
- Reliability
Product Features:
1.High Interconnect Density:Achieves fine-pitch wiring via microvias (diameter <150 μm),
blind/buried vias, and stacked structures, enabling more
connections per unit area.
2.Ultrafine Feature Sizes:Supports trace widths/spacings ≤50 μm using advanced lithography
(e.g., LDI), essential for miniaturized devices like smartphones.
3.Multilayer Complexity:Often involves 8+ layers with sequential lamination, allowing for
any-layer interconnects (Any Layer HDI) but increasing alignment
challenges.
4.Advanced Material Use:Employs thin cores (<100 μm), low-CTE substrates (e.g., modified
epoxy), and low-Dk dielectrics to enhance signal integrity and
thermal stability.
5.Enhanced Performance:Reduces signal loss, EMI, and latency with shorter electrical
paths, improving high-frequency operation (e.g., 5G applications).
Manufacturing process:
- Microvia technology: One of the key technologies of HDI PCB is microvia technology,
which uses laser or mechanical drilling to create tiny holes (gener
less than 0.2mm) on the circuit board, and these microvias are used
to achieve connections between layers.
- Multilayer wiring: HDI PCBs typically employ a multilayer design, connecting
different circuit layers through blind and buried vias.
Interconnection each layer is achieved through microvias, blind
vias, or buried vias, which enhances the density and integration of
the circuit board.
- Blind and buried via design: Blind vias are holes that connect only the outer and inner layers,
while buried vias are holes that connect the inner layers. The use
of these holes can further reduce the volume of the circuit board
and increase the wiring density.
- Surface treatment and assembly: The surface treatment of HDI PCBs requires higher precision and
reliability. Common surface treatments include gold plating, silver
pl, OSP (Organic Metal Surface Treatment), etc. In addition, the
assembly process of HDI PCBs usually requires fine welding
technology to ensure the close connection between and the circuit
board.
- High-precision process: In the manufacturing process of HDI PCB, high-precision etching
technology is required to ensure the correct manufacturing of fine
lines precision holes. At the same time, it is necessary to
precisely control variables such as current density, temperature,
and pressure to ensure the consistency and high performance.
