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4 Layer Solderable PCB Board HASL/OSP/ENIG Treatment Customized services

    Buy cheap 4 Layer  Solderable PCB Board HASL/OSP/ENIG Treatment Customized services from wholesalers
     
    Buy cheap 4 Layer  Solderable PCB Board HASL/OSP/ENIG Treatment Customized services from wholesalers
    • Buy cheap 4 Layer  Solderable PCB Board HASL/OSP/ENIG Treatment Customized services from wholesalers

    4 Layer Solderable PCB Board HASL/OSP/ENIG Treatment Customized services

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    Brand Name : xingqiang
    Model Number : Varies by goods condition
    Certification : ROHS, CE
    Price : NA
    Payment Terms : ,T/T,Western Union
    Supply Ability : 3000㎡
    Delivery Time : 12-15 work days
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    4 Layer Solderable PCB Board HASL/OSP/ENIG Treatment Customized services

    FR4 solderable 4-layer board PCB


    Product Description:

    Multilayer printed circuit boards (PCB) are a common type of circuit board in modern electronic devices. They consist of multiple single-sided or double-sided circuit boards stacked together with insulating materials in between, forming a single unit. Each layer of circuits is composed of different circuit layers, and these layers are connected together through vias or interconnecting lines. Compared with single-sided and double-sided PCBs, multi-layer PCBs can achieve more circuit wiring in a smaller space and are suitable for more complex and function-intensive circuit designs.


    Advantages of Multilayer PCB:

    • High Density
    • Improved Signal Integrity
    • Better Electromagnetic Compatibility (EMC)
    • Adapt to high-frequency applications
    • Better thermal management
    • Complexity and Cost


    Applications:

    • Telecommunications

    • Computers

    • Automotive electronics

    • Medical devices

    • Consumer electronics

    • Aerospace

    • Industrial control


    Manufacturing process:

    • Design and layout: During the design phase, engineers use PCB design software to lay out and route multilayer circuit boards, determining the functions of each's circuit and the interconnection method between layers.
    • Lamination: During the manufacturing process, multiple circuit layers are pressed together through a lamination process, with each layer separated by an insulating material. lamination process is typically carried out under high temperature and high pressure conditions.
    • Drilling and electroplating: Through-hole connections between different layers of the circuit are formed by drilling technology, and then electroplating is carried out ensure the conductivity of the through-holes.
    • Etching: On each layer of the circuit, use photolithography and etching techniques to form the circuit pattern, removing excess copper foil
    • Assembly and welding: After the components are installed, they can be soldered and connected using surface-mount technology (SMT) or traditional through-hole technologyTHT).



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