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4 Layer Solder Mask Multilayer PCB Board FR4 1.6mm for electronic equipment

    Buy cheap 4 Layer Solder Mask Multilayer PCB Board FR4 1.6mm for electronic equipment from wholesalers
     
    Buy cheap 4 Layer Solder Mask Multilayer PCB Board FR4 1.6mm for electronic equipment from wholesalers
    • Buy cheap 4 Layer Solder Mask Multilayer PCB Board FR4 1.6mm for electronic equipment from wholesalers

    4 Layer Solder Mask Multilayer PCB Board FR4 1.6mm for electronic equipment

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    Brand Name : xingqiang
    Model Number : Varies by goods condition
    Certification : ROHS, CE
    Price : NA
    Payment Terms : ,T/T,Western Union
    Supply Ability : 3000㎡
    Delivery Time : 12-15 work days
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    4 Layer Solder Mask Multilayer PCB Board FR4 1.6mm for electronic equipment

    4-layer solder mask custom FR4 1.6mm custom multilayer board PCB

    Product Description:

    4-layer solder mask custom FR4 1.6mm custom multilayer board PCB is a printed circuit board composed of three or more layers of circuits. Each layer of circuits is composed of different circuit layers, and these layers are connected together through vias or interconnecting lines. Compared with single-sided and double-sided PCBs, multi-layer PCBs can achieve more circuit wiring in a smaller space and are suitable for more complex and function-intensive circuit designs.


    Advantages of Multilayer PCB:

    • Increase circuit board density
    • Better signal integrity
    • Adapt to high-frequency applications
    • better thermal management
    • Higher reliability


    Product Features:

    • Multi-layer design
    • Inner layer and outer layer
    • Through hole
    • Copper layer
    • Dielectric layer (dielectric material)


    Applications:

    •Telecommunications (5G modules, routers)

    •Industrial control systems

    •Medical devices

    •Automotive electronics

    •LOT and smart hardware



    Manufacturing process:

    • Design and layout: During the design phase, engineers use PCB design software to lay out and route multilayer circuit boards, determining the functions of each's circuit and the interconnection method between layers.
    • Lamination: During the manufacturing process, multiple circuit layers are pressed together through a lamination process, with each layer separated by an insulating material. lamination process is typically carried out under high temperature and high pressure conditions.
    • Drilling and electroplating: Through-hole connections between different layers of the circuit are formed by drilling technology, and then electroplating is carried out ensure the conductivity of the through-holes.
    • Etching: On each layer of the circuit, use photolithography and etching techniques to form the circuit pattern, removing excess copper foil.



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