Background

With the rapid advancement of the semiconductor industry, the demand for higher performance in processing and inspection equipment continues to increase. Leveraging years of experience in motion control and ultra-precision positioning, we have developed a planar H-type dual-axis ultra-precision air-bearing stage.

The stage features a finite-element-optimized silicon carbide ceramic structure combined with compensated air-bearing technology, delivering both exceptional accuracy and superior dynamic performance. It is widely applied in:

• Semiconductor processing and inspection

• Micro/nano fabrication

• Nanometer-level fly-cutting and polishing

• High-speed scanning applications

Key Features

• Silicon carbide ceramic air-bearing guideway, ultra-high precision

• Maximum speed 1 m/s, acceleration up to 4 g, fast settling time

• Y-axis dual-drive gantry structure for high load capacity

• Optional encoder: optical grating or laser interferometer

• Positioning accuracy: ±0.15 μm; repeatability: ±75 nm

• Optimized cable management for clean design and stable operation

• Customizable design for specific applications

Ultra-Precision Design

• SiC Ceramic Structure: ~5× stiffness of aluminum alloy and ~5× lower thermal expansion coefficient, enhancing tracking accuracy and stability under high-speed operation.

• Air-Bearing Compensation: Proprietary compensation method improves stiffness and load capacity, ensuring fast motion and rapid settling.

• Dynamic Performance: Achieves 1 m/s velocity and 4 g acceleration, suitable for high-throughput processes.

• Flexible Integration: Compatible with active/passive vibration isolation, rotary stages, tilt modules, or wafer handling systems.

• Cable Optimization: Carefully designed bending radius prevents motion-induced stress, ensuring long-term reliability.

Direct-Drive Non-Contact Design

• Coreless Linear Motor: Delivers smooth motion with zero cogging force.

• Multi-Motor Drive: Scanning and stepping axes are powered by multiple motors positioned near the load plane, improving straightness, flatness, and angular precision.

• Thermal Management: Motors are thermally isolated and can be air- or water-cooled for high duty-cycle applications.

Specifications

Test Conditions:

• Air supply: clean and dry, dew point ≤ 0°F, particle filtration ≤ 0.25 μm, or 99.99% pure nitrogen.

• Accuracy measured 25 mm above stage center, at 20±1 °C, 40–60% RH.

Applications

• Semiconductor lithography, inspection, and wafer handling

• Micro/nano fabrication and metrology

• Precision optics manufacturing and interferometry

• Aerospace and scientific ultra-precision motion systems