SiC ceramic fork custom-made precision structural component, handle
wafers, optical component
Abstract of SiC ceramic fork
SiC Ceramic Fork Arm is a structural component made from advanced
silicon
carbide ceramic material. It is primarily used in precision
equipment requiring high rigidity, low thermal expansion
coefficient, and high wear resistance. The "fork arm" shape is
commonly found in high-end optical devices, semiconductor
processing equipment, and automated handling systems, serving as a
support, positioning, transmission, or clamping element. Compared
to traditional metal materials, silicon carbide ceramic offers
significant advantages in mechanical performance, thermal
stability, and corrosion resistance, and has gradually become a key
functional component in modern high-precision manufacturing.
Attribute table of SiC ceramic fork
| Property | Typical Value | Unit | Remarks |
| Material | Sintered Silicon Carbide (SSiC) | – | High-purity, high-density grade |
| Density | 3.10 – 3.15 | g/cm³ | |
| Hardness | ≥ 2200 | HV0.5 (Vickers) | One of the hardest engineering ceramics |
| Flexural Strength | ≥ 400 | MPa | 4-point bending test |
| Compressive Strength | ≥ 2000 | MPa | |
| Young's Modulus | 400 – 450 | GPa | Ultra-high stiffness |
| Thermal Conductivity | 120 – 180 | W/(m·K) | Excellent for heat dissipation |
| Coefficient of Thermal Expansion | ~4.0 × 10⁻⁶ | /K (25–1000 °C) | Very low; ideal for thermal stability |
| Maximum Operating Temperature | 1400 – 1600 | °C | In air; higher in inert atmosphere |
| Electrical Resistivity | > 10¹⁴ | Ω·cm | Insulating ceramic |
| Chemical Resistance | Excellent | – | Resistant to acids, alkalis, and solvents |
| Surface Roughness (after polishing) | < 0.02 | μm Ra | Optional for contact surfaces |
| Cleanroom Compatibility | Class 10 – 1000 | – | Suitable for semiconductor and optics use |
Design and Manufacturing of SiC Ceramic Fork Arms
Structural Design
SiC fork arms are custom-designed according to application
requirements. Common forms include "U-shaped" or "T-shaped" arms
used for:
Wafer handling
Probe card positioning
Optical module support
Key considerations in design include:
Load capacity and stress distribution
Thermal stress compensation
Precision mounting interfaces
Cleanroom compatibility
Processing Techniques
The manufacturing process involves several critical steps:
Powder preparation
Forming (dry pressing, isostatic pressing, or casting)
Sintering (e.g., pressureless sintering, reaction bonding)
Machining (grinding, laser drilling, EDM)
Surface finishing (polishing, coating, laser marking)
Process Flow Diagram for Preparation of SiC Ceramic Components
Application Scenarios of SiC ceramic fork
Semiconductor Equipment
SiC ceramic fork arms are commonly used in wafer handling systems
for processes such as photolithography, etching, and packaging.
Advantages include:
Non-contaminating surface
High temperature resistance
Excellent chemical durability
Compatibility with Class 10–1000 cleanrooms
Used in:
EFEM and FOUP load ports
6", 8", and 12" wafer transport
Vacuum pick-and-place systems
Optical Systems & Telescopes
In high-precision optical instruments, SiC fork arms provide:
Rigid support for mirrors and lenses
Stable alignment under thermal variations
Lightweight structures for dynamic positioning
They are often used in:
Interferometers
Space telescopes
Laser scanning systems
Aerospace & Defense of of SiC ceramic fork
In aerospace systems, SiC fork arms are valued for
Lightweight and stiffness under vibration
Resistance to radiation and thermal shock
Structural stability in low-earth orbit conditions
Typical roles include payload supports, gimbal linkages, and
optical mounts.
Robotic & Automation Systems
In cleanroom automation environments, SiC fork arms are used as
end-effectors or grippers, offering:
Non-conductive, non-particle-generating surfaces
Long service life in abrasive or corrosive environments
Resistance to outgassing in vacuum chambers
Customization & Technical Support
As a non-standard precision component, SiC ceramic fork arms are
typically customized based on user requirements. Customizable
parameters include:
Overall dimensions (length, width, thickness)
Opening size and angle
Surface finish and roughness
Chamfers, holes, slots
Wafer compatibility (6", 8", 12")
We support full-cycle services including drawing review, FEM
simulation for mechanical behavior, and prototype verification to
ensure performance and compatibility.
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