High performance Piezo Jet Valve in Speaker Hot Melt Adhesive
Dispensing applications
Piezo jet valves are increasingly used in the precision dispensing of hot melt
adhesives in speaker manufacturing, particularly for compact and
high-performance devices such as smartphone speakers, TWS (true
wireless stereo) earbuds, and smart speaker modules. These valves
offer non-contact, high-speed jetting capabilities that are ideal
for applying micro-doses of high-viscosity hot melt adhesives to
small, complex components with tight tolerances.
In speaker assembly, piezo jet valves are commonly used to bond the
diaphragm to the frame, seal acoustic chambers, fix magnetic
components, or secure dust caps and covers. The non-contact
dispensing method avoids damaging fragile structures like the
diaphragm or coil, while ensuring uniform glue distribution and
avoiding overflow, which is critical for maintaining acoustic
performance and visual cleanliness.
One of the key advantages of piezo valves in hot melt adhesive
applications is their ability to maintain consistent dot size and
volume, even at high viscosities (20,000–50,000 mPa·s) and elevated
temperatures (typically 160–180°C). With integrated heating modules
for both the valve body and the adhesive reservoir, systems like
Mingseal’s hot melt piezo jet valve KPS2000-R ensure thermal
stability and long open time, preventing premature solidification
and maximizing production uptime.
Core Advantages
- High viscosity hot melt adhesive compatibility
- Supports high temperature operation
- High jetting accuracy
- Module design, easy for operation
Main appliaction
Bonding of the diaphragm and the bracket
Sealing and waterproofing of the vibration system
Bonding of the cover or magnetic circuit
Technical parameters
| KPS2000-R adhesive dispensing valves |
| Minimum glue spraying amount | 0.5nl(CPK＞1.33) |
| Viscosity of glue | Medium or high viscosity(1-500,000mpas) |
| Max jetting frequency | 1200Hz |
| Corrosion resistance | All aqueous media, organic solvents, weak acids and weak bases |
| Size | 125.5×40×20mm(No runner assembly included) 125.5×75×20mm(Includes runner assembly) |
| Weight | 430g(With fluid box, no cables) |
| KPC2000 controller |
| AC power input | AC 220V±20% |
| 0.01ms~6000.00ms,0.01ms |
| Jetting frequency | 1~1200HZ |
| Settings display | TFT color screen |
| 10 set |
| Reserved interface | Supports RS232/RS485 |
| Weight | 3.55KG |
| Size | 232×170×165 mm |
| Power | 275W |
FAQ
Q1: Can the piezo jet valve handle high-viscosity hot melt
adhesives used in speaker assembly?
A1: Yes. Piezo jet valves are engineered to dispense hot melt
adhesives with viscosities up to 50,000 mPa·s. Equipped with
heating modules for the valve and tank, they maintain consistent
temperature and flow, ensuring stable jetting performance during
speaker diaphragm or frame bonding.
Q2: How does the valve prevent overflow or glue defects on small
speaker components?
A2: With non-contact, micro-precision dispensing, piezo valves
ensure uniform dot size and placement even in narrow bonding areas.
This minimizes glue overflow and improves cosmetic appearance and
acoustic reliability in TWS and smartphone speaker modules.
Q3: How is nozzle condition maintained during continuous high-speed
operation?
A3: The valve includes heating and sealing components to prevent
clogging and carbonization. Routine cleaning is simple, and the
design minimizes nozzle wear, ensuring stable performance for long
production runs.
About Mingseal
Founded in 2008, Changzhou Mingseal Robot Technology Co., Ltd. is a
technology-driven manufacturer of high-end equipment, specializing
in connection, assembly, inspection systems, and key components for
advanced semiconductor packaging and precision electronics. Our
solutions are widely adopted by leading customers in sectors such
as semiconductor packaging, consumer electronics, and automotive
electronics. With a strong presence across Asia and the Americas,
we deliver reliable support and innovation globally.
Partner with Mingseal to power the future of automatic
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