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4 Inch IC Chip Tray For High Durability And Eco-Friendly Used In Semiconductor Packaging Field

    Buy cheap 4 Inch IC Chip Tray For High Durability And  Eco-Friendly Used In Semiconductor Packaging Field from wholesalers
     
    Buy cheap 4 Inch IC Chip Tray For High Durability And  Eco-Friendly Used In Semiconductor Packaging Field from wholesalers
    • Buy cheap 4 Inch IC Chip Tray For High Durability And  Eco-Friendly Used In Semiconductor Packaging Field from wholesalers
    • Buy cheap 4 Inch IC Chip Tray For High Durability And  Eco-Friendly Used In Semiconductor Packaging Field from wholesalers
    • Buy cheap 4 Inch IC Chip Tray For High Durability And  Eco-Friendly Used In Semiconductor Packaging Field from wholesalers
    • Buy cheap 4 Inch IC Chip Tray For High Durability And  Eco-Friendly Used In Semiconductor Packaging Field from wholesalers

    4 Inch IC Chip Tray For High Durability And Eco-Friendly Used In Semiconductor Packaging Field

    Ask Lasest Price
    Brand Name : Hiner-pack
    Model Number : HN23147
    Certification : ISO 9001 SGS ROHS
    Price : TBC
    Delivery Time : 1~2 Weeks
    Payment Terms : 100% Prepayment
    Supply Ability : 2000PCS/Day
    • Product Details
    • Company Profile

    4 Inch IC Chip Tray For High Durability And Eco-Friendly Used In Semiconductor Packaging Field

    Product Description:


    • Waffle packs are a popular format for handling small parts and delicate microelectronics such as semiconductor die, photonics optics, and chip scale components. They are small, thin and incredibly convenient for small parts. Waffle packs are also well established and have become an unofficial standard format in the industry, just like JEDEC matrix trays.

    Technical Parameters:


    Brand NameHiner-pack
    Pocket Size4.01*5.75*1.6mm
    External Dimension101.6x101.6x4.57mm
    Matrix Qty11X14=154PCS
    MOQ1000PCS
    Place of OriginChina

    Applications:

    Semiconductor Manufacturing:

    • Die Packaging: After cutting wafers into individual dies, waffle packs are employed to securely hold these ICs. This minimizes the risk of physical damage or contamination before they are mounted onto PCBs (Printed Circuit Boards).
    Testing and Quality Control:
    • Transporting Tested Components: Once components are tested and confirmed to be functional, waffle packs are used to transport them to the packaging lines or storage. This ensures their cleanliness and preserves their integrity during transportation.

    Features:

    • High-Density Polyethylene (HDPE): This material offers good chemical resistance, durability, and is lightweight. It provides a non-contaminating surface, which makes it ideal for semiconductor applications.
    • Anti-Static Coated Materials: Various plastics can be treated with anti-static coatings to prevent electrostatic discharge (ESD). This property is essential for safeguarding sensitive electronic components during handling and transport.
    • Thermoplastics: This material can be easily molded and reshaped. It's versatile and commonly used for creating custom waffle pack designs that fit specific components.

    Support and Services:

    • Customization to meet specific requirements
    • Installation and setup assistance
    • Product training and education
    • Regular maintenance and updates

    FAQ:

    Q1: What is the brand name of this IC Chip Tray?

    A1: The brand name of this IC Chip Tray is Hiner-pack.

    Q2: What is the model number of this IC Chip Tray?

    A2: The model number of this IC Chip Tray is Waffle Pack Series.

    Q3: Where is this IC Chip Tray made?

    A3: This IC Chip Tray is made in China.

    Q4: Does this IC Chip Tray have any certification?

    A4: Yes, this IC Chip Tray has ISO 9001, SGS, and ROHS certification.

    Q5: What is the minimum order quantity for this IC Chip Tray?

    A5: The minimum order quantity for this IC Chip Tray is 1000.

    Quality 4 Inch IC Chip Tray For High Durability And  Eco-Friendly Used In Semiconductor Packaging Field for sale
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