Diamond Wire Single-Line Cutting Machine for
SiC/Sapphire/Quartz/Ceramic Material
The diamond wire single-line cutting machine is a high-precision
processing equipment for hard and brittle materials, utilizing
diamond-impregnated wire (diamond wire) as the cutting medium to
achieve efficient and low-loss cutting through high-speed
reciprocating motion. This machine is primarily designed for
processing hard and brittle materials such as sapphire, silicon
carbide (SiC), quartz, glass, silicon rods, jade, and ceramics,
including operations like cropping, truncation, cutting-off, and
slicing—especially suitable for precision cutting of high-hardness
and large-sized materials.
Featuring a modular design, the machine can be equipped with
optional rotary worktables, high-tension systems, and circular
cutting functions to meet diverse processing needs. Compared to
traditional abrasive wire cutting or laser cutting, diamond wire
cutting offers higher efficiency, lower material loss, and superior
surface quality, making it widely applicable in industries such as
semiconductors, photovoltaics, LEDs, precision optics, and jewelry
processing.
Technical Specification of Diamond Wire Single-Line Cutting Machine
Item
| Parameter
| Item
| Parameter
|
Maximum work size
| 600×500(mm)
| Constant tension(N)
| 15.0N~130.0N
|
Swing angle
| 0~±12.5
| Tension accuracy(N)
| ±0.5
|
Swing frequency
| 6~30
| Running direction
| Bidirectional or unidirectional
|
Lift stroke(mm)
| 650(mm)
| Sliding stroke(mm)
| Maximum 500 (mm)
|
Lift speed(mm/min)
| 0~9.99
| Storage(L)
| 30
|
rapid travelling speed(mm/min)
| 200
| Power consumption
| 44.4kw
|
Center Distance of Cutting Guide Wheel(mm)
| 680~825
| Mortar motor
| 0.2kw
|
Diamond wire diameter(mm)
| φ0.12~φ0.45
| Noise
| ≤75dB(A)
|
Running speed (m/s)
| 1500m/min
| Cutting speed
| ＜3 hours (6-inch SiC) (m/s²)
|
Acceleration (m/s²)
| 5
| Power Line Specifications
| 4x16+1x10(mm²)
|
Size(length/width/height)
| 2680×1500×2150(mm)
| Cutting accuracy
| <3μm(6寸SiC)(N)
|
Weight
| 3600kg
| Gas supply Requirements
| >0.5MPa
|
Working Principle of Diamond Wire Single-Line Cutting Machine
The core working principles of the diamond wire single-line cutting
machine include:
- High-Speed Diamond Wire Motion: The diamond-coated wire moves
reciprocally at speeds up to 1500 m/min, driven by a guide wheel
system, achieving material cutting through the grinding action of
diamond particles.
- Precision Feeding System: The workpiece is fed via servo motor
control combined with high-precision linear guides, ensuring
dimensional accuracy up to ±0.02 mm.
- Cooling and Debris Removal: A water-based coolant flushes the
cutting area to reduce thermal impact and remove debris, preventing
edge chipping.
- Optional Functional Extensions:
- Rotary Worktable: Enables multi-angle cutting (e.g., circular or
bevel cuts) for cylindrical or irregularly shaped workpieces.
- High-Tension System: Enhances cutting stability for ultra-hard
materials (e.g., SiC ingots).
Key Features of Diamond Wire Single-Line Cutting Machine
1. High-Efficiency Processing
- Maximum wire speed of 1500 m/min, ideal for efficient cutting of
ultra-hard materials like SiC and sapphire, with 50% higher
efficiency than traditional abrasive wire cutting.
- Optimized wire bow control technology minimizes material waste,
enabling slice thicknesses as low as 0.2 mm and improving material
utilization by 30%.
2. Intelligent Operation and Flexibility
- Equipped with a user-friendly touchscreen interface for one-touch
parameter storage and recall, streamlining operations.
- Rapid switching between cutting modes (e.g., straight-line,
curved-line, multi-wafer synchronous cutting) to adapt to varied
processing requirements.
3. Modular Functional Extensions
- Optional rotary worktable for precision circular or angled cuts on
cylindrical workpieces (e.g., silicon rods, raw jade).
- High-tension system (20-60 N range) prevents wire breakage and
deviation during hard material cutting.
- Supports automatic tool alignment and vision positioning for
enhanced precision in complex-shape processing.
4. Robust Structural Design
- High-strength cast/forged machine body offers superior vibration
resistance and long-term stability, ensuring consistent cutting
accuracy.
- Critical components (e.g., guide wheels, spindles) feature ceramic
or tungsten carbide coatings, extending service life beyond 5000
hours.
Application Fields of Diamond Wire Single-Line Cutting Machine
1. Semiconductor Industry
- SiC ingot slicing: For power device substrate preparation, with
cutting loss below 100 μm.
- Sapphire window processing: Precision cutting for LED epitaxial
wafers and optical windows.
2. Photovoltaic Industry
- Silicon rod truncation and slicing: For
monocrystalline/polycrystalline solar cell production, with cutting
speeds up to 800 m/min.
3. Precision Optics and Jewelry
- Quartz glass and jade cutting: Delivers high surface quality (Ra
<0.5 μm), reducing post-polishing steps.
4. Research and Specialty Ceramics
- Aluminum nitride (AlN) and zirconia ceramic slicing: Meets demands
for high-temperature components in aerospace.
Conclusion
With its high efficiency, precision, and low material loss, the
diamond wire single-line cutting machine has become essential for
hard and brittle material processing. As demand grows for
third-generation semiconductors (SiC/GaN) and high-end optical
components, its applications in 5G communications, electric
vehicles, and photovoltaic energy will expand further. Future
advancements will focus on AI-driven control and automated loading
systems, steering the technology toward intelligent and unmanned
operation.
Q&A of Diamond Wire Single-Line Cutting Machine
1. Q: What materials can be cut with a diamond wire saw?
A: Diamond wire saws excel at cutting hard brittle materials
including silicon carbide (SiC), sapphire, quartz, ceramics, and
semiconductor crystals with precision up to ±0.02mm.
2. Q: How does diamond wire cutting compare to laser cutting for
SiC wafers?
A: Diamond wire cutting achieves 50% faster processing of SiC with
<100μm material loss versus laser's thermal damage risk and
higher kerf loss.
Tag: #Diamond Wire Single-Line Cutting Machine, #Customized, #SiC/Sapphire/Quartz/Ceramic Material Processing
