Multi-Wire Diamond Saw Cutting Machine for SiC/Sapphire/Ultra-Hard
Brittle Materials
The multi-wire diamond saw cutting machine is a high-efficiency,
precision slicing equipment specifically designed for ultra-hard
and brittle materials. It employs parallel cutting technology using
multiple diamond-impregnated wires to simultaneously process
multiple workpieces. This machine is primarily used for high-speed,
high-efficiency, and high-precision multi-wafer cutting of
materials such as silicon carbide (SiC), gallium nitride (GaN),
sapphire, quartz, and ceramics, making it ideal for mass production
in semiconductor, photovoltaic, and LED industries.
Compared to single-wire cutting machines, the multi-wire system
significantly enhances productivity by enabling dozens to hundreds
of slices per operation, while maintaining exceptional cutting
accuracy (±0.02 mm) and surface quality (Ra <0.5 μm). Its
modular design supports automatic loading, tension adjustment, and
intelligent monitoring, meeting industrial continuous production
requirements.
Multi-Wire Diamond Saw Cutting Machine Technical Data
Item
| Parameter
| Item
| Parameter
|
Maximum work size (Square material)
| 220×200×350(mm)
| Main drive motor
| 17.8kw×2
|
Maximum work size (Circular material)
| Φ205×350(mm)
| Wiring/radio motor
| 11.86kw×2
|
Spindle spacing(Diameter × Length × Quantity)
| Φ250 ± 10 × 370 × 2 axis (mm)
| Workbench elevator motor
| 2.42kw×1
|
Principal axis
| 650mm
| Workbench swing motor
| 0.8kw×1
|
Running speed
| 1500m/min
| Arrangement motor
| 0.45kw×2
|
Diamond wire diameter
| Φ0.12～Φ0.25(mm)
| Tension motor
| 4.15kw×2
|
Lift speed
| 225mm
| Mortar motor
| 7.5kw×1
|
Maximum Workbench Speed
| ±12deg
| Storage
| 300L
|
Swing angle
| ±3deg
| Flow rate
| 200L/min
|
Swing frequency
| About 30 times per minute
| Accuracy of temperature control
| ±2℃
|
Storage
| 0.01～9.99mm/min
| Power voltage
| 3*35+2*10(mm²)
|
Flow rate
| 0.01～300mm/min
| Compressed air supply
| 0.4-0.6MPa
|
Size
| 3550×2200×3000(mm)
| Weight
| 13500kg
|
Diamond Wire Single-Line Cutting Machine Working Principle
The core operational mechanisms include:
1.Multi-Wire Synchronized Motion System:
- Dozens to hundreds of diamond wires run synchronously at speeds up
to 1500 m/min, driven by guide wheels, achieving material cutting
via diamond particle abrasion.
- Features closed-loop tension control (adjustable 15-130 N) to
ensure uniform wire tension, preventing breakage or deviation.
2.Precision Feeding & Positioning System:
- Workpiece feeding is controlled by high-precision servo motors with
linear guides, achieving positioning accuracy of ±0.005 mm.
- Optional vision alignment or laser tool setting enhances
complex-shape cutting precision.
3.Cooling & Debris Management:
- High-pressure coolant (water- or oil-based) flushes the cutting
zone to reduce thermal impact and remove debris, minimizing edge
chipping.
- Equipped with multi-stage filtration to extend coolant lifespan.
4. Intelligent Control System:
- B&R servo drives (response time <1 ms) enable real-time
dynamic adjustments of speed, tension, and feed rate.
- Supports parameter storage/recall and one-click material-specific
mode switching.
Multi-Wire Diamond Saw Cutting Machine Key Features
1. High-Throughput Multi-Wafer Cutting:
- Maximum wire speed of 1500 m/min with 50-200 slices per run
(material-dependent), boosting productivity 5-10x over single-wire
systems.
- Optimized for SiC/GaN, achieving <100 μm kerf loss and 40%
higher material utilization.
2. Precision Control & Intelligence:
- B&R servo system ensures ±0.5 N tension accuracy for stable
cutting across material hardness levels.
- 10-inch HMI displays real-time parameters (speed, tension,
temperature) and enables recipe storage/remote monitoring.
3. Modular Expandability:
- Optional robotic loading/unloading systems for unmanned production.
- Supports wire diameter switching (φ0.12-0.45 mm) for
rough-to-finish processing versatility.
4. Industrial-Grade Reliability:
- High-strength cast/forged frame with <0.01 mm deformation under
prolonged operation.
- Ceramic-coated/Tungsten carbide guide wheels and spindles
(>8000-hour service life).
Multi-Wire Diamond Saw Cutting Machine Application Fields
1. Semiconductor Industry:
- SiC wafer dicing: For EV inverter and fast-charging module
substrates.
- GaN epitaxial wafer cutting: 5G RF devices and microwave chips.
2. Photovoltaics:
- Mono/polycrystalline silicon ingot slicing: 1200 m/min speed with
<±10 μm thickness variation.
3. LED & Optics:
- Sapphire substrate cutting: LED epitaxial wafers and camera covers
with <20 μm edge chipping.
4. Advanced Ceramics & R&D:
- Alumina/AlN ceramic slicing: High-precision processing for
aerospace thermal components.
ZMSH's services
ZMSH specializes in the R&D, production, and technical services
of multi-wire diamond saw cutting systems, delivering integrated
solutions from equipment to material processing for semiconductor
industry clients. Our high-performance multi-wire diamond saws
feature modular designs capable of high-efficiency multi-wafer
cutting of ultra-hard brittle materials including SiC ingots,
sapphire rods, and quartz glass, achieving maximum cutting speeds
of 1500m/min while maintaining precision within ±0.02mm through
intelligent tension control systems and B&R servo drives. We
offer customized services tailored to diverse processing
requirements, encompassing equipment parameter optimization,
cutting process development, and contract processing for
specialized materials (e.g., large-format SiC substrates or
irregular sapphire components). Furthermore, our technical support
team provides full-cycle assistance including equipment
installation/commissioning, operator training, process
optimization, and after-sales maintenance to ensure seamless
transition from pilot to mass production. For both semiconductor
manufacturers and research institutions, we deliver professional
cutting solutions adapted to material properties (e.g., hardness,
CTE) to optimize both processing efficiency and yield rates.
Multi-Wire Diamond Saw Cutting Machine Q&A
1. Q: What is the maximum cutting speed of a multi-wire diamond saw
for silicon carbide?
A: Advanced multi-wire diamond saws achieve cutting speeds up to
1500 m/min for SiC wafers with ±0.02mm precision.
2. Q: How many wafers can a multi-wire saw cut simultaneously
compared to single-wire?
A: Multi-wire saws typically cut 50-200 wafers per run
(material-dependent), offering 5-10x higher productivity than
single-wire systems.
Tag: #Multi-Wire Diamond Saw Cutting Machine, #Customized, #SiC/Sapphire/Ultra-Hard Brittle Materials Processing
