Fused Quartz Wafers High Purity Thermal Stability and Optical Clarity for Advanced
Applications
Product Overview of Fused Quartz Wafers
“Fused Silica” or “Fused Quartz” which is the amorphous phase of
quartz (SiO2). When contrasted to borosilicate glass, fused silica
has no additives; hence it exists in its pure form, SiO2. Fused
silica has a higher transmission in the infrared and ultraviolet
spectrum when compared to normal glass. Fused silica is produced by
melting and re-solidifying ultrapure SiO2. Synthetic fused silica
on the other hand is made from silicon-rich chemical precursors
such as SiCl4 which are gasified and then oxidized in a H2 + O2
atmosphere. The SiO2 dust formed in this case is fused to silica on
a substrate. The fused silica blocks are cut into wafers after
which the wafers are finally polished.
Key Features and Benefits of Fused Quartz Wafers
Ultra-high purity (≥99.99% SiO₂)
Ideal for contamination-sensitive processes in semiconductors and
photonics.
Wide temperature range
Withstands cryogenic to >1100°C thermal environments without
deformation.
Exceptional UV and IR transmittance
Offers excellent optical clarity from deep ultraviolet (DUV) to
near-infrared (NIR).
Low thermal expansion
Ensures dimensional stability under thermal cycling, reducing
component stress.
Chemical inertness
Resistant to most acids, bases, and solvents; perfect for harsh
process conditions.
Surface quality control
Available in ultra-smooth, double-side polished formats for optical
and MEMS applications.
Manufacturing Process
Fused quartz wafers are produced through the following steps:
Raw Material Selection: High-purity natural quartz sand or crystals are selected and
purified.
Melting and Fusion: Quartz granules are melted at ~2000°C in electric furnaces under
controlled atmosphere to remove bubbles and impurities.
Solidification and Block Forming: The molten material is cooled into solid ingots or blocks.
Wafer Slicing: Precision wire saws cut the solidified fused quartz into wafer
blanks.
Lapping and Polishing: Wafer surfaces are ground, lapped, and polished to achieve exact
thickness and flatness.
Cleaning and Inspection: Final wafers are ultrasonically cleaned in Class 100/1000
cleanrooms and inspected for defects.
Applications
Fused quartz wafers are used across industries requiring optical
transparency, thermal durability, and chemical resistance:
Semiconductors
Carrier wafers in high-temperature processes
Diffusion and ion implantation masks
Etching, deposition, and inspection platforms
Photonics & Optics
Substrates for optical coatings
Laser windows and beam splitters
Precision UV and IR optical components
Laboratory & Research
Sample carriers for analytical instruments
Microfluidic and chemical analysis platforms
High-temperature reaction substrates
LED & Solar
Available Specifications
| spec | unit | 4" | 6" | 8" | 10" | 12" |
|---|
| Diameter / size (or square) | mm | 100 | 150 | 200 | 250 | 300 |
| Tolerance (±) | mm | 0.2 | 0.2 | 0.2 | 0.2 | 0.2 |
| Thickness | mm | 0.10 or more | 0.30 or more | 0.40 or more | 0.50 or more | 0.50 or more |
| Primary reference flat | mm | 32.5 | 57.5 | Semi-notch | Semi-notch | Semi-notch |
| LTV (5mm×5mm) | μm | < 0.5 | < 0.5 | < 0.5 | < 0.5 | < 0.5 |
| TTV | μm | < 2 | < 3 | < 3 | < 5 | < 5 |
| Bow | μm | ±20 | ±30 | ±40 | ±40 | ±40 |
| Warp | μm | ≤ 30 | ≤ 40 | ≤ 50 | ≤ 50 | ≤ 50 |
| PLTV (5mm×5mm) < 0.4μm | % | ≥95% | ≥95% | ≥95% | ≥95% | ≥95% |
| Edge Rounding | mm | Compliant with SEMI M1.2 Standard / refer to IEC62276 |
| Surface Type | | Single Side Polished / Double Sides Polished |
| Polished side Ra | nm | ≤1 | ≤1 | ≤1 | ≤1 | ≤1 |
| Back Side Criteria | μm | general 0.2-0.7 or customized |
Technical Advantages
Glass-like structure eliminates birefringence found in crystalline quartz
No crystal axis—ideal for isotropic behavior in optical applications
Non-porous, smooth surface for improved cleanliness and coating adhesion
Suitable for bonding, dicing, and photolithography
Low OH content grades available for improved UV durability
Frequently Asked Questions (FAQ)
Q1: What’s the difference between fused quartz and fused silica?
Both refer to amorphous SiO₂, but “fused silica” often implies
synthetically produced high-purity glass, while “fused quartz” is
derived from natural quartz. Their properties are nearly identical
in most applications.
Q2: Can fused quartz wafers be used in high-vacuum environments?
Yes, fused quartz has extremely low outgassing and high thermal
stability, making it ideal for vacuum systems and space
applications.
Q3: Are these wafers suitable for UV laser applications?
Absolutely. Fused quartz exhibits excellent transmission in the
deep UV range (down to ~185 nm), making it well-suited for DUV
laser optics and photomask substrates.
Q4: Do you offer customization?
Yes, we manufacture wafers based on customer requirements including
diameter, thickness, surface finish, and laser cutting patterns.
