Material Composition
The base material for this PCB is TP980, known for its advanced
dielectric properties. This thermoplastic material comprises a
blend of ceramics and polyphenylene oxide (PPO) resin,
intentionally designed without fiberglass reinforcement. This
unique composition allows for precise adjustments of the dielectric
constant, making TP980 suitable for a wide range of high-frequency
applications.
PCB Stackup
The stack-up of this PCB is meticulously designed to optimize
performance:
- Copper Layer 1: 35 μm of copper is used for the first layer,
providing necessary routing and grounding capabilities.
- TF980 Core: The core material, measuring 4.0 mm (157.5 mils),
contributes significantly to the board's dielectric properties,
enhancing signal integrity and thermal management.
- Copper Layer 2: An additional 35 μm copper layer serves a similar
function as the first, allowing for efficient routing and component
placement.
PCB Specification
| Parameter | Specification |
| Base Material | TP980 |
| Layer Count | Double Sided |
| Board Dimensions | 68mm x 68mm ± 0.15mm |
| Minimum Trace/Space | 7/5 mils |
| Minimum Hole Size | 0.7mm |
| Blind Vias | No |
| Finished Board Thickness | 4.1mm |
| Finished Cu Weight | 1oz (1.4 mils) for outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Electroless Nickel Immersion Gold (ENIG) |
| Top Silkscreen | No |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Electrical Testing | 100% electrical test prior to shipment |
Artwork and Quality Standards
This PCB artwork is supplied in the Gerber RS-274-X format, a
widely used standard in PCB manufacturing that ensures
compatibility across various fabrication processes. This format
allows for precise communication of the PCB design to
manufacturers.
Adhering to IPC-Class-2 quality standards, this PCB meets essential
requirements for reliability and performance, ensuring it can be
used in various applications without compromising functionality.
Availability
The TP980 PCB is available worldwide, making it a versatile choice
for manufacturers and designers looking to implement high-frequency
solutions in their electronic products.
Features of TP980
- Dielectric Constant (Dk): 9.8 ± 0.2 at 10 GHz, ensuring stable
performance for high-frequency signals.
- Dissipation Factor: 0.0012 at 10 GHz, indicating low energy loss
during signal transmission.
- Thermal Coefficient of Dielectric Constant (TCDK): -40 ppm/°C,
maintaining performance across a wide temperature range of -55°C to
150°C.
- CTE Values:
- X-axis: 40 ppm/°C
- Y-axis: 40 ppm/°C
- Z-axis: 55 ppm/°C
- Thermal Conductivity: 0.65 W/mk, facilitating effective heat
dissipation.
- Moisture Absorption: 0.01%, reducing the risk of moisture-related
failures.
- UL Rating: 94-V0, ensuring compliance with fire safety standards.
Typical Applications
The TP980 PCB is particularly suited for demanding applications,
including:
- Global Satellite Navigation Systems: Offering the necessary
precision and reliability for navigation technology.
- Missile-borne Technologies: Meeting stringent performance and
reliability standards essential in defense applications.
- Fuze Technology: Providing robust and reliable performance in
critical safety applications.
- Miniaturized Antennas: Enabling compact designs without
sacrificing performance, crucial in modern communication systems.
Conclusion
TP980 PCB exemplifies the intersection of advanced materials
science and electronics engineering. With its exceptional
dielectric properties, robust construction, and adherence to
quality standards, it is a premier choice for high-frequency
applications. As the demand for reliable and efficient PCBs
continues to rise, the TP980 stands ready to meet the challenges of
modern electronic design.
