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Needle Dispensed Dowsil Adhesive EA-4100 For Electronics Encapsulation

    Buy cheap Needle Dispensed Dowsil Adhesive EA-4100 For Electronics Encapsulation from wholesalers
     
    Buy cheap Needle Dispensed Dowsil Adhesive EA-4100 For Electronics Encapsulation from wholesalers
    • Buy cheap Needle Dispensed Dowsil Adhesive EA-4100 For Electronics Encapsulation from wholesalers
    • Buy cheap Needle Dispensed Dowsil Adhesive EA-4100 For Electronics Encapsulation from wholesalers
    • Buy cheap Needle Dispensed Dowsil Adhesive EA-4100 For Electronics Encapsulation from wholesalers

    Needle Dispensed Dowsil Adhesive EA-4100 For Electronics Encapsulation

    Ask Lasest Price
    Brand Name : DOWSIL
    Model Number : EA-4100
    Price : CN¥52.33
    Delivery Time : 5-8days
    Payment Terms : T/T,L/C,D/A,D/P,Western Union,MoneyGram
    Supply Ability : 1000Piece
    Certification : TDS,SDS,Rohs
    • Product Details
    • Company Profile

    Needle Dispensed Dowsil Adhesive EA-4100 For Electronics Encapsulation

    Dowsil EA-4100 Needle-Dispensed Adhesive for Electronics Encapsulation


    Basic Properties​


    Dowsil EA-4100 is a one-part, moisture-cure white paste adhesive with density 1.42 g/cm³ (cured), Shore A hardness 45, and elongation at break 250%. Designed for needle dispensing in electronics encapsulation, operable from -45°C to 200°C.


    Product Description​


    EA-4100 cures via ambient moisture-triggered condensation, eliminating heating systems (tack-free in 9 min@25°C). 260 g/min extrusion rate suits automated dispensing, while 1 cm slump enables uniform filling. Volume resistivity and dielectric strength data not provided in TDS.


    Characteristics​


    Property​​​​Value​​​​Test Condition​​
    ​​Cure Mechanism​​Moisture CureAmbient RH 30-80%
    ​​Color​​White PasteVisual
    ​​Extrusion Rate​​260 g/min
    ​​Slump Flow​​1 cm
    ​​Tack-Free Time​​9 min25°C
    ​​Tensile Strength​​2.3 MPa
    ​​Elongation at Break​​250%
    ​​Shore A Hardness​​45Cured

    Application Scenarios​


    Power Module Potting: Encapsulates IGBT modules. 250% elongation absorbs thermal cycling stress, compliant with MIL-STD-810G thermal shock.
    Automotive Sensor Bonding: Adheres O₂ sensor connectors. -45°C flexibility prevents cracking, implemented in Bosch assembly lines.
    LED Driver Sealing: Edge-seals outdoor PCBs. Moisture-cure properties suit high-humidity environments, achieving IP67 rating.
    Chip Reinforcement: Secures processor peripherals. 45 Shore A hardness balances impact resistance & stress relief, used in Huawei base stations.


    FAQ:


    1. Who are we?

    We are Shenzhen Huazhisheng New Material Technology Co., Ltd., a professional industrial adhesives and sealants supplier based in China since 2018. we serve global markets: Mainland China (60%), Southeast Asia (20%), North America (10%), and Europe (10%).


    2. What products do you offer?

    we supply high-performance adhesives and sealants from global leaders including:

    Cemedine, Dow Corning, Shin-Etsu, Araldite, and Momentive,etc.


    3. How do you guarantee product quality?

    Quality assurance through:

    Mandatory pre-production samples approval

    Final inspection by QC team before shipment

    International certifications: SGS, UL, FDA, RoHS, REACH


    4. Why choose us over other suppliers?

    Reliable Supply:Authentic products from top manufacturers

    Expert Support:Technical guidance for product selection

    Global Compliance:Certifications meeting target market standards

    Efficient Service:Customized solutions & professional support


    5. What services do you provide?

    Delivery​:EXW/FOB/CIF

    Payment​:USD/EUR/CNY/HKD via T/T, L/C

    Support​:Technical consultation & logistics coordination

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