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2 Component Thermal Conductive Silicone Potting Compound Adhesive Liquid Gel

    Buy cheap 2 Component Thermal Conductive Silicone Potting Compound Adhesive Liquid Gel from wholesalers
     
    Buy cheap 2 Component Thermal Conductive Silicone Potting Compound Adhesive Liquid Gel from wholesalers
    • Buy cheap 2 Component Thermal Conductive Silicone Potting Compound Adhesive Liquid Gel from wholesalers
    • Buy cheap 2 Component Thermal Conductive Silicone Potting Compound Adhesive Liquid Gel from wholesalers
    • Buy cheap 2 Component Thermal Conductive Silicone Potting Compound Adhesive Liquid Gel from wholesalers
    • Buy cheap 2 Component Thermal Conductive Silicone Potting Compound Adhesive Liquid Gel from wholesalers

    2 Component Thermal Conductive Silicone Potting Compound Adhesive Liquid Gel

    Ask Lasest Price
    Brand Name : Hanast
    Model Number : HN-8806AB
    Certification : MSDS
    Price : 4.6
    Payment Terms : T/T
    Supply Ability : 1000000KG
    Delivery Time : 3-7 work days
    • Product Details
    • Company Profile

    2 Component Thermal Conductive Silicone Potting Compound Adhesive Liquid Gel

    Rtv Silicone Two Component Thermal Conductive Adhesive Waterproof Low Viscosity Waterproof Sealing High Moisture Resistance Glue

    HN-8806 Two-Component Addition-Type Silicone Potting Rubber


    Product Specification

    Test ItemsTest StandardUnitsProduct test results
    Part APart B
    Before curing1Appearance------Grey, fluidWhite, fluid
    2ViscosityGB/T10247-200825ºC, mPa·S4500~50004500~5000
    3DensityGB/T 13354-9225ºC, g/cm³1.50±0.051.50±0.05
    4Mixing Ratio (A : B)1:01Weight ratio100100
    Volume ratio100100
    5Operating timeMeasuredhr0.3-0.4
    6Curing conditionMeasuredhr4^12 (25ºC,initial cure)
    0.20 (80ºC)
    After
    Curing
    7Appearance------Grey elastomer
    8HardnessGB/T 531.1-2008Shore A50±5
    9Thermal conductivityGB/T10297-1998w/m·k≥0.76
    10ExpansivityGB/T20673-2006μm/(m,ºC)210
    11Moisture AbsorptionGB/T 8810-200524h,25ºC, %0.01~0.02
    12Volume resistivityGB/T 1692-92(DC500V),Ω · cm1.0×10¹⁵
    13Dielectric intensityGB/T 1693-2007Kv/mm(25ºC)18^25
    14Temperature ResistanceMeasuredºC-50~+250°c

    Product Advantages

    High-Performance Elastomer: Forms a high-elasticity, high-strength protective layer after curing.

    Low Viscosity: Suitable for deep-section potting, ensuring even distribution.

    No By-Products: No heat or by-products are emitted during curing, ensuring component safety.

    Flame Retardant: Passes UL-94 flame retardancy tests, ensuring safety in high-temperature environments.

    Eco-Friendly Certification: Complies with RoHS standards, non-polluting.

    Applications

    Potting and sealing of power modules, circuit boards, and high-voltage transformers.

    Protection and thermal management for battery packs and fast-charging adapters.

    Moisture-proof and waterproof protection for LED outdoor drive power supplies.

    Other electronic components requiring vibration, water, and thermal protection.

    Application Method

    1.Mix components A and B in a 1:1 ratio, stir thoroughly, and then proceed with potting.

    2.Ensure the surface of the components is clean before potting. For large products, pot in stages.

    3.For automated production lines, vacuum components A and B separately to ensure accurate mixing ratio.

    Technical Parameters


    Appearance: Part A – Grey fluid; Part B – White fluid

    Viscosity: 4500~5000 mPa·S

    Density: 1.50±0.05 g/cm³

    Mixing Ratio (A:B): 1:1

    Pot Life: 0.3-0.4 hours

    Curing Conditions: 4-12 hours at room temperature (initial cure), 0.2 hours at 80°C

    Hardness: 50±5 Shore A

    Thermal Conductivity: ≥0.76 W/m·K

    Volume Resistivity: 1.0×10¹⁵ Ω·cm

    Temperature Resistance: -50°C to +250°C


    Packaging
    10KG/Set (A 5kg + B 5kg)
    20KG/Set (A 10kg + B 10kg)
    50KG/Set (A 25kg + B 25kg)


    Precautions

    Stir components A and B separately before use to ensure even mixing.

    Avoid contact with substances containing tin, sulfur, or amines to prevent curing inhibition.

    Maintain cleanliness during use to prevent contamination.

       
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