Optical system | Optical camera | 5 million high-speed intelligent digital industrial camera |
Resolution (FOV) | Standard 15μm/Pixel (corresponding FOV: 38mm*30mm) 10/15/20μm/Pixel
(optional) |
Optical lens | 5M pixel level telecentric lens, depth of field: 8mm-10mm |
Light source system | High brightness RGB coaxial ring multi-angle LED light source |
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Hardware Configuration | Operating system | Windows 10 Professional |
Computer Configuration | i3CPU, 8G GPU graphics card, 16G memory, 120G solid state drive,
1TB mechanical hard drive |
machine power | AC 220 volts ±10%, frequency 50/60Hz, rated power 1.2KW |
Machine size | 1100mm×900mm×1350mm (L × W × H) height including feet |
Machine weight | 450kg |
Optional configuration | Off-line programming software, external barcode gun MES
traceability system interface is open |
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Detect PCB specifications | Size | 40×40mm ~450×330mm (larger size can be customized according to
customer requirements) |
thickness | 0.3mm ~6mm |
Board weight | ≤3KG |
Clear height | Upper net height ≤ 35mm, lower net height ≤ 70mm (special
requirements can be customized) |
Minimum test element | 0201 components, 0.3 mm pitch and above IC (optional can reach
01005 components) |
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Test items | Solder paste printing | Presence, deflection, less tin, more tin, open circuit, pollution,
tin connection, etc. |
Part Defect | Missing parts, shifting, skewing, tombstones, standing sideways,
overturned parts, reversed polarity, wrong parts, damaged parts,
multiple parts, etc. |
Solder joint defects | Less tin, more tin, even tin, virtual soldering, multiple pieces,
etc. |
Wave Soldering Inspection | Insert pin, no tin, less tin, more tin, virtual soldering, tin
bead, tin hole, open circuit, multiple pieces, etc. |
Red plastic board detection | Missing parts, shifting, skewing, tombstones, standing sideways,
overturned parts, reversed polarity, wrong parts, damage,
overflowing glue, multiple parts, etc. |
