SMT 3D AOl Machine Automated Optical Inspection SINICTEK A510 and
A630 3D In-line SMT AOI Machine For PCB Manufacturing Testing
Equipment
Product Specification
| Technology Platform | Single lane Type-c Platform |
| Series | A Series |
| Model | A510 /A630 |
| Measurement Principle | Sine white projection PMP inspection |
| Measurements | Missing parts, offset, rotation, three-dimensional polarity, upside
down, OCV , side standing, tombstone, poor soldering, etc. |
| Detection of Non-Performing Types | Solder tip, solder volume percentage, excessive solder,
insufficientsolder, bridge, hole plugging, solder filet, pad
contamination, etc. |
| Lens Resolution | 6.5M 13.5um/16.5um option；12M 12um/15um option |
| Accuracy XY (Resolution): | 10um |
| Repeatability | height:≤1um (4 Sigma);volume/acreage:<1%(4 Sigma); |
| Gage R&R | <<10% |
| Inspection Speed | 0.45 SEC/FOV |
| Quanlity of Inspection Head | 4piece |
| Mark-point Detection Time | 0.5sec/piece |
| Maximun Meauring Head | 10mm |
| Maximum height of element on PCB | 50mm |
| Maximun Measuring Height of PCB Warp |
|
| Minimum element | 1005 |
| MaximunLoading PCB Size(X*Y) | 450x450mm (A510) |
| 600x550mm (A630) |
| Conveyor Setup | front orbit (back orbit as option) |
| PCB Transfer Direction | Left to right or Right to left |
| Conveyor Width Adjustment | manual & automatic |
| Engineering Statistics SPC | :Production Trend；Xbar-R Chart；Xbar-S Chart；CP&CPK；%Gage
Repartability Data；AOI Daily/Weekly/Monthly Reports |
| Gerber & CAD Data Import | (support Gerber format(274x,274d),Artificial called the pattern,
X/Yimport CAD) |
| Operating System Support | Windows 10 Professional (64 bit) |
| Equipment Diemension and Weight | W1000xD1174xH1550,985Kg |
| Optional | 1D /2 D Barcode Scanner; Badmark Function; three-point function;
offline programming; Repair Station |
Programmable structure grating (PSLM) technology
The programmable structure grating (PSLM) is developed and
manufactured independently to form a full-spectrum structure
grating. Compared with the traditional moiré gratings, the
structure grating can be modulated and controlled by software The
detection capability and application range of the equipment are
greatly improved.
AI intelligent seamless puzzle technology
3D SMT AOI adopts innovative AI intelligent seamless jigsaw puzzle
technology, which reaches the level of indiscernibility to the
naked eye, and for the problems of uneven, uneven, uneven color and
image distortion encountered at the joint between Fov and Fov of
traditional Aoi, it improves the positioning accuracy of the
detection box and reduces the debugging time of the program.
After intelligent seamless mosaic technology processing of the
image, can not see uneven, uneven, uneven color, image distortion
Enhanced Super RGB Pro 2D light source
3DAOI adopts the self-developed enhanced multi-angle, multi-area,
adjustable RGB + w + coaxial 2D light source design, which is
suitable for the detection of components, solder joints and text in
various situations.
Intelligent program editing: simple, fast
3DAOI adopts the method of intelligent program editing and the mode
of template parameter setting, so it is convenient to write and
debug programs quickly.
3D + 2D ontology positioning technology
3DAOI adopts 3D localization technology and 2D localization
technology as assistant to ensure accurate localization of Chip and
IC components and PIN PIN and black components.
High frame number CXP camera scheme, 4/8 projection head detection
scheme
The 3D AOI camera uses the COAXPRES (SCXP-6) standard with a 1200W
resolution and a frame rate of up to 188 frames to ensure
industry-leading test speed. 3D AOI can achieve the best detection
scheme by using the optional 4 projection heads + 8 projection
heads and PSLM multi-frequency projection capability, covering all
SMT applications.
SPC analysis software and closed-loop control settings
3D AOI has a complete SPC analysis software and closed-loop
control, to ensure that 3D AOI test data can be fully statistical
and analytical, and can be easily traceable; 3DAOI three-point
integration function, using Sinic-Tek's 3DSPI and 3DAOI, specific
measurements of a single PAD can be queried.
Applications:
Widely used in electronics manufacturing, consumer electronics,
automobile electronics, communications equipment, aerospace,
medical equipment, LED lamps, computers and peripherals, smart
home, smart logistics, miniature and high power ratio electronic
devices.
