Wafer Thinning System Precision Thinning Equipment SiC Si Wafer
Compatible 4 -12inch Wafer Capacity
Wafer Thinning Equipment Technical Overview
Wafer Thinning Equipment enables precision thinning of 4-12inch
brittle semiconductor materials including silicon (Si), silicon
carbide (SiC), gallium arsenide (GaAs), and sapphire substrates,
achieving thickness control accuracy of ±1 μm and total thickness
variation (TTV) ≤2 μm to meet the stringent requirements of
advanced packaging and power device fabrication. Wafer Thinning
Equipment through optimized coordination of grinding parameters and
polishing processes, the equipment ensures precise adaptation to
diverse material properties, particularly addressing the thinning
challenges of wide-bandgap semiconductors like SiC. Wafer Thinning
Equipment guarantees minimal thickness deviation and low surface
roughness, integrated with automated real-time thickness monitoring
to maintain stable and reliable processing performance.
Wafer Thinning Equipment Specifications
| Equipment Model | Key Advantages |
|---|
| 12-inch Semi-Auto Thinner Equipment | - Customizable vacuum chuck solutions for irregular products
|
- Extendable height measurement range up to 40mm
|
- Integrated process solutions
|
| 8-inch Full-Auto Thinner Equipment | - UPH surpasses imported models (30pcs/h for standard wafers)
|
- Compatible with semi-auto handling for irregular products
|
- Integrated process solutions
|
| 12-inch Full-Auto Thinner Equipment | - Full-Automation System Compatible
|
- Compatible with semi-auto handling for irregular products
|
- Integrated process solutions
|
Advantages:
· Mature and stable processing technology
· High-precision In-Feed spindle grinding with superior machining
accuracy
· User-friendly operation and ergonomic HMI (Human-Machine
Interface)
· Precision Z-axis control via imported ball screws, linear guides,
and high-accuracy servo motors (minimum resolution: 0.1 μm/s)
· High-rigidity air-bearing spindle combined with ultra-precise
wafer chuck assembly and thickness gauge ensures process stability
and reliability
Functions:
· Operation log recording
· 4"-12" wafer material compatibility
· Real-time high-precision contact thickness measurement
· Spindle water cooling system
· Full-auto/Semi-auto operation modes
Wafer Thinning Equipment photo
12-inch Semi-Auto Thinner Equipment 8-inch Full-Auto Thinner
Equipment 12-inch Full-Auto Thinner Equipment
Applications
· Silicon-Based Power Device Fabrication: Wafer Thinning Equipment
enables wafer thinning processes for DSC and other silicon power
devices；
· Compound Semiconductor Device Packaging: Wafer Thinning Equipment
supports substrate-level thinning for GaAs/GaN-based components；
· Silicon Carbide Device Processing: Wafer Thinning Equipment
delivers precision thinning of SiC ingots/wafers for power module
requirements；
Machining effect——Wafer Thinning Equipment
· High-Speed Thinning for SiC, GaN, Sapphire, GaAs, and InP Wafers
· Automated pre-alignment and thickness measurement
· High-rigidity, low-vibration spindle with minimal RPM fluctuation
(adjustable creep/rapid feed rates)
