In the fast-evolving world of electronics, revolutionary
advancements in RF design are critical. The newly launched RF-10
PCB stands out, engineered for excellence in signal transmission
and optimized for high-frequency applications.
Material Composition and Structure
Constructed from advanced RF-10 copper clad laminates, this PCB
combines ceramic-filled PTFE with woven fiberglass. This unique
composition ensures unmatched performance for high-frequency
circuits, paving the way for compact solutions to modern electronic
challenges.
Key Features of RF-10 PCBs
The RF-10 PCB boasts a dielectric constant of 10.2 ± 0.3 at 10GHz,
allowing for significant size reduction in RF circuit designs.
Coupled with a low dissipation factor of 0.0025 at the same
frequency, the PCB minimizes signal loss, ensuring reliable and
efficient communication.
Performance Benefits for High-Frequency Applications
High thermal conductivity of 0.85 W/mk enhances thermal management,
making the RF-10 PCB ideal for applications where reliability is
paramount. The low coefficients of thermal expansion (CTE) further
ensure dimensional stability, reducing the risk of mechanical
failure during operation.
| Property | Test Method | Unit | Value | Unit | Value |
| Dk @ 10 GHz | IPC-650 2.5.5.5.1 Mod. | | 10.2 ± 0.3 | | 10.2 ± 0.3 |
| Df @ 10 GHz | IPC-650 2.5.5.5.1 Mod. | | 0.0025 | | 0.0025 |
| TcK† (-55 to 150 °C) | IPC-650 2.5.5.6 | ppm/°C | -370 | ppm/°C | -370 |
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.08 | % | 0.08 |
| Peel Strength (1 oz. RT copper) | IPC-650 2.4.8 (solder) | lbs/in | 10 | N/mm | 1.7 |
| Volume Resistivity | IPC-650 2.5.17.1 | Mohm/cm | 6.0 x 107 | Mohm/cm | 6.0 x 107 |
| Surface Resistivity | IPC-650 2.5.17.1 | Mohm | 1.0 x 108 | Mohm | 1.0 x 108 |
| Flexural Strength (MD) | IPC - 650 - 2.4.4 | psi | 14,000 | N/mm2 | 96.53 |
| Flexural Strength (CD) | IPC - 650 - 2.4.4 | psi | 10,000 | N/mm2 | 68.95 |
| Tensile Strength (MD) | IPC - 650 - 2.4.19 | psi | 8,900 | N/mm2 | 62.57 |
| Tensile Strength (CD) | IPC - 650 - 2.4.19 | psi | 5,300 | N/mm2 | 37.26 |
| Dimensional Stability | IPC-650 2.4.39 (After Etch) | % (25 mil-MD) | -0.0032 | % (25 mil-CD) | -0.0239 |
| Dimensional Stability | IPC-650 2.4.39 (After Bake) | % (25 mil-MD) | -0.0215 | % (25 mil-CD) | -0.0529 |
| Dimensional Stability | IPC-650 2.4.39 (After Stress) | % (25 mil-MD) | -0.0301 | % (25 mil-CD) | -0.0653 |
| Dimensional Stability | IPC-650 2.4.39 (After Etch) | % (60 mil-MD) | -0.0027 | % (60 mil-CD) | -0.0142 |
| Dimensional Stability | IPC-650 2.4.39 (After Bake) | % (60 mil-MD) | -0.1500 | % (60 mil-CD) | -0.0326 |
| Dimensional Stability | IPC-650 2.4.39 (After Stress) | % (60 mil-MD) | -0.0167 | % (60 mil-CD) | -0.0377 |
| Density (Specific Gravity) | IPC-650-2.3.5 | g/cm3 | 2.77 | g/cm3 | 2.77 |
| Specific Heat | IPC-650-2.4.50 | J/g°C | 0.9 | J/g°C | 0.9 |
| Thermal Conductivity (Unclad) | IPC-650-2.4.50 | W/M*K | 0.85 | W/M*K | 0.85 |
| CTE (X -Y axis) (50 to 150 °C) | IPC-650 2.4.41 | ppm/°C | 16-20 | ppm/°C | 16-20 |
| CTE (Z axis) (50 to 150 °C) | IPC-650 2.4.41 | ppm/°C | 25 | ppm/°C | 25 |
| Flammability Rating | Internal | | V-0 | | V-0 |
Technical Specifications Overview
Featuring a 2-layer rigid stackup, the RF-10 PCB includes precise
technical specifications that cater to demanding RF applications.
With a finished board thickness of 3.2mm and a comprehensive
quality assurance process, this PCB is designed for peak
performance.
Versatile Applications in Modern Electronics
The versatility of the RF-10 PCB allows for its use in various
applications, including microstrip patch antennas, GPS systems, and
passive components. It is a game changer for RF applications
worldwide, enabling engineers to unlock new potentials in circuit
design.
Quality Assurance and Manufacturing Standards
Adhering to IPC-Class-2 standards, the RF-10 PCB undergoes 100%
electrical testing prior to shipment. This commitment to quality
ensures that every unit meets the high expectations of performance
and reliability.
Global Availability and Accessibility
With worldwide availability, the RF-10 PCB is accessible to
manufacturers and engineers looking to enhance their RF designs.
The industry-compliant delivery times make it a preferred choice
for modern electronic applications.
Future Trends in RF Technology
As we look ahead, the RF-10 PCB positions itself at the forefront
of RF technology innovation. It embodies the principles of
precision engineering and reliability, setting the stage for future
advancements in electronic design.
Conclusion: Embracing the Future with RF-10
In conclusion, the RF-10 PCB represents a significant leap forward
in high-frequency technology. With its superior features and
benefits, it is more than just a product; it is a catalyst for
innovation in the RF landscape. Embrace the future of RF design
with the unmatched capabilities of the RF-10 PCB.
