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PCB manufacturing 6-layer 2-level HDI control board Plate thickness 2.0mm, Lianmao IT180A, gold settling, impedance, 3/3mil line distance, laser secondary, electroplating hole filling, resin plug PCB manufactur...
...PCB or PCBA Black PCB General who we are Single Sided Plated Through Hole Multi-Layer (Up to 40 Layers) including buried and blind Via's Multi-Layer with bonded heat sinks Flexible PCB Flex-Rigid PCB our adv...
...PCB or PCBA Green PCB General RAM supplier who we are Single Sided Plated Through Hole Multi-Layer (Up to 40 Layers) including buried and blind Via's Multi-Layer with bonded heat sinks Flexible PCB Flex-Rigi...
...PCB Maker DDR5/DDR4/DDR3/U-DIMM/SO-DIMM Green and black MEMORY PCB who we are Single Sided Plated Through Hole Multi-Layer (Up to 40 Layers) including buried and blind Via's Multi-Layer with bonded heat sink...
... Material: FR4, high Tg RoHS Directive-compliant Board thickness: 0.4-5.0 mm +/-10% Layer count: 1-22 layers Copper weight: 0.5-5oz Min finish hole side: 8 mils Laser drill: 4 mils Min trace width/space: 4/4...
... PCB Assembly 1. Features of Bluetooth PCBA • Material: FR4 Tg180, 6-layer • Minimum trace/space: 0.1mm • Blind and buries via and via in pad Material: FR4, high Tg RoHS Directive-compliant Board thickness: ...
4 layer/High frequency mixed pressure PCB /Communication blind buried via/FR4/ENIG HFPs are electronic components used for many different applications, from radio communication to high-performance computing. HF...
...Layer Printed Circuit Board With Blind And Buried Holes PCB Specifications: Layer Count: 6Layer HDI PCB Board Thickness: 0.6MM Material: FR4 TG150 Holes: L1-L2 0.1MM, L2-L5 0.15MM, L5-L6 0.1MM, L1-L6 0.5MM M...
... 1-6oz Finished copper thickness 1/3oz – 2oz Min trace width/spacing 3/3mil Min through hole 0.2mm Min blind via 0.1mm Types of blind via Stack microvia, Stagger microvia Surface treatment Immersion Gold, Se...
10 Layer Printed Circuit Board IATF 16949 Motor PCB Assembly Main Features: 1 10 Layer customized printed circuit board manufacturered based on customer's gerber files. 2 Used in Motor areas. 3 Material is FR4 ...
10 Layer Printed Circuit Board IATF 16949 Motor PCB Assembly Main Features: 1 10 Layer customized printed circuit board manufacturered based on customer's gerber files. 2 Used in Motor areas. 3 Material is FR4 ...
... vias 125 µm bump pitch processing Description: Model: XCER Layer: 4 Surface finish: immersion gold Board size:18*6cm Board thickness: 0.8mm Special: buried blind hole Parameter Min bonding pad space 0.1mm(4...
...layers HDI third-order, half-hole + metal edging + gold finger pcb rapid prototyping prototype pcb service pcb service 1: Medical Bluetooth module motherboard 2: FR-4, TG170, inner and outer copper thickness...
...PCB assembly manufacturing ICT FCT Fixture Our PCB and PCBA ServiceS 1. PCB Assembly: SMT, THT/DIP, BGA, COB soldering. 2. PCB Manufacture: 1-24 layers, Buried & Blind via PCB, Imdepence PCB, Highfrequency P...
... via PCB, Imdepence PCB, Highfrequency PCB, FR-4,Aluminium PCB. 3. PCBA Testing Jigs: Automated & Manual Tooling.&Suppliy by customer. 4. PCB Design: we need a idea or schematic diagram for PCB & PCBA design...
... Green & White Quality Standard IPC Class 2, 100% E-testing Certificates TS16949, ISO9001, UL, RoHS Photoes of this 4Layer PCB ENIG Computer circuit board for telecommunication board with blind holes What KA...
...Blind Slot Power Supply board Detail Specifications: Layers 1-20Layers Material FR-4 Board Thickness 0.8-3.0mm Copper Thickness 1-6oz Surface Treatment ENIG 1u"/HASL Soldmask & Silkscreen Green & White Quali...
... thickness. Also, the board size of this Multilayer PCB Board is 94 * 88 mm, with red solder mask and ENIG surface treatment. Quick Details One of the largest PCB(Printed Circuit Board) manufacturers in Chin...
...PCB BGA Package PCB Manufacturing Service ♦ What is HDI PCB? HDI PCB uses micro blind/buried vias and build-up technology to create high-density circuits. It forms micron-level interlayer connections via las...
... with insulating (dielectric) material. These layers are interconnected through plated through-holes (PTHs), vias, or buried/blind vias, enabling complex circuit designs in a compact form. ♦ Key Featur...