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XILINX XC6SLX16-2FTG256C BGA Embedded Processor Embedded Processor is a microprocessor that is designed to be integrated into a larger system, such as a computer or electronic device. It typically includes a ra...
...-4 Tg170 substrate for the application of PLC controls. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. A BGA package is placed on...
...-4 Tg170 substrate for the application of PLC controls. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. A BGA package is placed on...
Ball Grid Array (BGA) 63164-136T Take Your Business to the Next Level with Contactor and Durable Product Description: A contactor is an essential component in electrical systems that are used to control the flo...
PCBA Board Fabrication Ball Grid Array Bga Pcb Assembly Quick Turn prototype and mass production PCB FASTPCBA dedicated in manufacturing 1-48 layers quick turn prototype and mass production High precision PCBs ...
OEM PCBA Aluminum PCB Prototyping Ball Grid Array FR4 Rapid PCBA Rapid PCBA Introduction Rapid PCBA is a short delivery method. Generally speaking, according to the number of components and inventory of the com...
New Energy PCB Assembly with AOI,ICT,100% Visual Inspection,FT SMT Parameters: Technology Involved: Special Technology Involved IC Programming BGA rework Chip on Board/COB Eutectic soldering Auto-Glui...
Instrumentation focuses on the development of master control system devices based on fieldbus technology and intelligent instruments, special and special automatic instruments; Expand the service field comprehe...
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Pcb Soldering Service Pcb Sourcing PCBA Aoi SMT PCBA Assembly Shenzhen Yideyi Technology Limited Company is a professional manufacturing enterprise majoring in high end and multi-layer Printed Circuit Board. A...
...: unknown JESD - 30 : S - PBGA - B1357 code The number of terminals :1357 Packaging body material Plastic Encapsulate the code BGA Encapsulation equivalent code BGA1357,37X37,40 Packaging shape :SQUARE Encap...
...devices with a high number of pins arranged in a grid pattern. These sockets allow for reliable electrical connections and easy insertion/removal of PGA-packaged chips. Common pitch sizes ......
... industries, including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB manufacturing, Semiconductor production, Batteries, Small Metal Casting, Electronic ......
EP4CE40F23C8N IC FPGA 328 I/O 484FBGA Mfr Intel Series Cyclone IV E Package Tray Product Status Active Number of LABs/CLBs 2475 Number of Logic Elements/Cells 39600 Total RAM Bits 1161216 Number of I/O 328 Vol...
Product Description: Wave Soldering Pallet The Wave Soldering Pallet is an essential tool for the wave soldering process in the electronics manufacturing industry. This product is designed to withstand high tem...
...permanently mount devices such as microprocessors. It can reduce package size and integrating a greater number of functions on a single chip module. BGA also replaces solder balls on the component underside ...
...BGA balls. This feature eliminates the need for manual alignment, reducing the risk of errors and increasing efficiency. The HD monitor provides a clear view of the BGA balls, making it easy to monitor the r...