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Bga Package Datasheet

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Iphone IC Chip APL1096/343S00474 Power Management Circuit BGA Package IC Chip

...BGA Package IC Chip Product Description Of APL1096/343S00474 APL1096/343S00474 is IC Chip - Power Management Circuit, BGA Package. Specification Of APL1096/343S00474 Part Number: APL1096/343S00474 Package...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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High Density PCB Micro BGA Package Assembly Service Integrated Solution

...BGA Assembly Service - Integrated Solution for Precision Welding and X-ray Inspection ♦ What is BGA Assembly? BGA Assembly (Ball Grid Array Assembly) is a high-density packaging technology in which the chip ...

DQS Electronic Co., Limited
China

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High‑definition FPD SMT BGA Packaging X‑ray Inspection Machine AX9500 Unicomp

... PCB and BGA analysis. This fully upgraded system performs CT detection on BGA, CSP, flip chips, LEDs, and other semiconductors, while also supporting SMT welding analysis with advanced 3D tomography CT scan...

Unicomp Technology
Guangdong,China

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XC6SLX150-2FGG676I Programmable IC Chip 676-BGA Package Embedded FPGAs Abundant Flexible Logic Resources

...BGA Package Embedded FPGAs Abundant Flexible Logic Resources Number of LABs/CLBs 11519 Number of Logic Elements/Cells 147443 Total RAM Bits 4939776 Number of I/O 498 Voltage - Supply 1.14V ~ 1.26V Mounting T...

Shenzhen Sai Collie Technology Co., Ltd.
China

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ENIG Wire/die Bond BGA package Substrate IC Packaging Substrate fabrication

Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Sp...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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BGA Package Solder Paste DIP Turnkey PCB Assembly 700*460mm

BGA Package Solder Paste One Stop Service SMT DIP Turnkey PCB Assembly Box Build Technical Requirement for turnkey pcb ......

Chengdu Cesgate Technology Co., Ltd
Sichuan,China

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High Viscosity 3W/MK Thermally Conductive Putty For BGA Package

3W/mK thermal conductivity high viscosity thermally conductive putty for BGA package Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal int...

Dongguan Ziitek Electronical Material and Technology Co., Ltd
Guangdong,China

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0.1mm Stainless Steel Shim SMT Stencil PCB Assembly For BGA Package

SMT Stencil Laser Cut 0.1mm Stainless Steel Shim for BGA Package 1.1 General description This is a type of SMT stencil (100% laser cut) built on 0.10mm stainless steel foil with aluminum frame 520 mm x 420 mm x...

Bicheng Technologies Limited
Guangdong,China

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Black JEDEC Tray for BGA-Packaged Chip Complies With Standard Design Matrix 8x16=128PCS

Black JEDEC Tray That Holds The BGA-Packaged Chip Complies With Standard Design Product Description: JEDEC Trays: The Safest Way to Handle and Transport Semiconductor Devices When it comes to semiconductor devi...

Shenzhen Hiner Technology Co., Ltd.
Guangdong,China

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LTM4622IY 4A 20V Synchronous Step-Down µModule Regulator with 95% Efficiency 3.1-20V Input ±1.5% Output Accuracy 2.5MHz Switching and 6.25mm × 6.25mm BGA Package

... Regulator with 95% Efficiency 3.1-20V Input andplusmn;1.5% Output Accuracy 2.5MHz Switching and 6.25mm andtimes; 6.25mm BGA Package andnbsp; FEATURES n Complete Solution in andlt;1cm2 n Wide Input Voltage R...

TOP Electronic Industry Co., Ltd.
China

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MPC8260AZUPIBB MPU Microcontrollers and Processors BGA Package

MPC8260AZUPIBB MPU Microcontrollers and Processors BGA Package TYPE DESCRIPTION Categories Integrated Circuits (ICs) Embedded - Microcontrollers Series MSP430™ FRAM Packaging Tape & Reel (TR) Part Status Active...

Mega Source Elec.Limited
China

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New Original E1116AEBG-8E-F BGA Packaged Flash Memory

New Original E1116AEBG-8E-F BGA Packaged Flash Memory PRODUCT DESCRIPTION Part number E1116AEBG-8E-F is manufactured by ELPIDA and distributed by Stjk. As one of the leading distributors of electronic products,...

STJK(HK) ELECTRONICS CO.,LIMITED
China

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CSR8645B04-IBBC-R BGA Package Bluetooth Main Control Chip RF360

CSR8645B04-IBBC-R BGA Package Bluetooth Main Control Chip RF360 New Imported Original Spot Product Attribute Attribute Value Select Attribute ......

QIN XIN (HONG KONG) ELECTRONIC TECHNOLOGY CO.,LIMITED
China

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ADV7842KBCZ-5P ADV8003KBCZ-8 ADV8003KBCZ-8B IC BGA Package

...BGA IC Integrated Circuits Components Specification :ADV7842KBCZ-5P ADV8003KBCZ-8 ADV8003KBCZ-8B Category Integrated Circuits (ICs) Product Name Electronic components Model number ADV7842KBCZ-5P ADV8003KBCZ-...

HK NeoChip Technology Limited
China

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ADV7842KBCZ-5P ADV8003KBCZ-8 ADV8003KBCZ-8B ADI IC BGA Package

...BGA IC Integrated Circuits Components Specification :ADV7842KBCZ-5P ADV8003KBCZ-8 ADV8003KBCZ-8B Category Integrated Circuits (ICs) Product Name Electronic components Model number ADV7842KBCZ-5P ADV8003KBCZ-...

Angel Technology Electronics Co
Hongkong,China

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High Density Fine Line BT IC Substrate for Advanced FC-CSP and WB-BGA Packages

BT IC substrate product line is engineered for advanced package formats including FC-CSP (Flip Chip Chip Scale Package) and WB-BGA (Wire Bond Ball Grid Array). BT resin, with its high glass transition temperatu...

Shenzhen Jiaqing Circuit Co., Ltd.
China

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IPQ4019-0vv IPQ4019 IPQ4019-OVV BGA package network chip new original

...

G-Resource Electronics Co.,Ltd

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THGBMTG5D1LBAIL E-MMC products integrate flash memory and e-MMC controller into a single BGA package to perform functions such as error correction, loss balancing,

Catalogue eMMC Interface type eMMC 5.0 Storage capacity 4GB Working temperature-25�� ~+85�� Sequential reading speed 152 MB/s Sequential writing speed is 14 MB/s NAND working voltage (VCCF) is 2.7V ~ 3.6V. The wo...

Shenzhen Hefengxin Technology Co., Ltd.
China

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