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Bga Package Datasheet

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Total 4847 products for bga package datasheet Manufacture & Suppliers

XCVC1502-2MSIVSVG Integrated Circuit Chip AI Core Field Programmable Gate Array BGA Package

...BGA Package Product Description Of XCVC1502-2MSIVSVG XCVC1502-2MSIVSVG is built around an integrated shell composed of a programmable network on chip (NoC), which enables seamless memory-mapped access to the...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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Field Programmable Gate Array XCVC1502-2MLEVBVA Programmable Logic IC BGA Package

... Logic Cells, AI Core Versal, the package is BGA. Specification Of XCVC1502-2MLEVBVA Part Number: XCVC1502-2MLEVBVA I/O: 114 – 530 Speed: 400MHz, 1GHz Serial Bandwidth (Full Duplex) - ......

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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1.5M Logic Cells XCVC1502-1MLIVSVG Field Programmable Gate Array 256KB BGA Package

... Cells XCVC1502-1MLIVSVG Field Programmable Gate Array 256KB BGA Package Product Description Of XCVC1502-1MLIVSVG XCVC1502-1MLIVSVG is Embedded System On Chip, the package is BGA, Connecting between the proc...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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Ethernet Chip BCM4389C1SKFFB WiFi 6E Smartphone Chip BGA Package Circuit Chip

...BGA Package Circuit Chip Product Description Of BCM4389C1SKFFB BCM4389C1SKFFB provides to test wireless throughput between Wi-Fi 6E-capable routers and phones using 160 MHz channels in the 6 GHz band. Speci...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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2.4 Gbps Ethernet Chip BCM4398D0XKWBG BGA Package WiFi 6E Smartphone Chip

...BGA Package WiFi 6E Smartphone Chip Product Description Of BCM4398D0XKWBG BCM4398D0XKWBG is 2.4 Gbps Ethernet Chip - WiFi 6E Smartphone Chip, achieved a maximum throughput of 2.01 Gbps. Specification Of BC...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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Ethernet Chip BCM84885B0IFEBG Dual Port Ethernet CMOS Transceiver BGA Package

...BGA Package Product Description Of BCM84885B0IFEBG BCM84885B0IFEBG supports the USXGMII, XFI, 5000BASE-X, 2500BASE-X, and 1000BASE-X (SGMII) interface for connection to a MAC. Specification Of BCM84885B0IFE...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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Ethernet Chip BCM89611A2BFBG Automotive RGMII-SGMII Converter BGA Package

...BGA Package Product Description Of BCM89611A2BFBG BCM89611A2BFBG automatically negotiates with its link partner to determine the highest possible operating speed. BCM89611A2BFBG is designed to comply with t...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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Automotive Ethernet Switch BCM89586MA0BFSBG BGA Package Integrated Circuit Chip

...BGA Package Integrated Circuit Chip Product Description Of BCM89586MA0BFSBG BCM89586MA0BFSBG is seventh generation of fully integrated L2+ multilayer switch solutions to support automotive qualification (AE...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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BT IC BES2600YP Ultra Low Power BT Audio SoC BGA Package Dual Mode BT 5.3 Chip

... of BT+Noise Reduction+In Ear Detection. It supports dual mode BT 5.3 and multipoint connection. Specification Of BES2600YP Part Number: BES2600YP Package: BGA Type: Ultra Low Power BT Audio SoC Subsystem: S...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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Ethernet IC BCM84848A1KFSBLG Four-Port 10GBASE-T Transceiver IC BGA Package

...-Port 10GBASE-T Transceiver IC BGA Package Product Description Of BCM84848A1KFSBLG BCM84848A1KFSBLG is a complete quad 100BASE-TX, 1000BASE-T and 10GBASE-T solution operating at 100m over CAT6a UTP cable. It...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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DDR4 SDRAM Memory IC Chip with 8Gb Density 512M x 16 Organization in BGA Package

P3A8GL4BLF-GJN Memory IC Chip DDR4 8Gb SDRAM Memory BGA Package Product Description Of P3A8GL4BLF-GJN P3A8GL4BLF-GJN is DDR4 8Gb SDRAM Memory in BGA package. DDR4 memory chips offer higher frequencies, lower vo...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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Quad Port BCM84884EB0KFSBG Ethernet CMOS Transceiver BGA Package Integrated Circuit Chip

...BGA Package Integrated Circuit Chip Product Description Of BCM84884EB0KFSBG BCM84884EB0KFSBG is a quad-port 5GBASE-T/2.5GBASE-T/1000BASE-T/100BASE-TX Ethernet CMOS transceiver. BCM84884EB0KFSBG supports the...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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ENIG Wire/die Bond BGA package Substrate IC Packaging Substrate fabrication

Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Sp...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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2-6 Layer BT taw material BGA packaging Substrate For semiconductor assembly

Application:IC substrate package,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of s...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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BGA Package of Memory Substrate with ENEPIG ENIG Soft Gold Surface

MicroSD / TF Memory Substrate Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; When you send inquiry us,Pls be know that we have to get the following...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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Display Power Supply TPS65657B0YCFR TPS65657 Iphone IC Chip BGA Package

Display Power Supply TPS65657B0YCFR TPS65657 Iphone IC Chip BGA Package Product Description Of TPS65657B0YCFR TPS65657B0YCFR is Display power supply, package is DSBGA25, Suitable for Iphone 14pro max. Applicati...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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BGA Package Solder Paste DIP Turnkey PCB Assembly 700*460mm

BGA Package Solder Paste One Stop Service SMT DIP Turnkey PCB Assembly Box Build Technical Requirement for turnkey pcb ......

Chengdu Cesgate Technology Co., Ltd
Sichuan,China

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High Viscosity 3W/MK Thermally Conductive Putty For BGA Package

3W/mK thermal conductivity high viscosity thermally conductive putty for BGA package Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal int...

Dongguan Ziitek Electronical Material and Technology Ltd.
Guangdong,China

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0.1mm Stainless Steel Shim SMT Stencil PCB Assembly For BGA Package

SMT Stencil Laser Cut 0.1mm Stainless Steel Shim for BGA Package 1.1 General description This is a type of SMT stencil (100% laser cut) built on 0.10mm stainless steel foil with aluminum frame 520 mm x 420 mm x...

Bicheng Electronics Technology Co., Ltd
Guangdong,China

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BT Audio SoC BES2500YP-60 TWS Headset Main Control Chip BGA Package

BT Audio SoC BES2500YP-60 TWS Headset Main Control Chip BES2500 BGA Package Product Description BES2500YP-60 low-power BT audio SoC supports dual-mode BT 5.2, adaptive ANC ......

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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