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Product Attribute Attribute Value Select Attribute Manufacturer: Micron Technology Product Category: NOR Flash Mounting Style: SMD/SMT Package / Case: BGA-64 Series: M29EW Memory Size: 1 Gbit Supply Voltage - M...
New Original E1116AEBG-8E-F BGA Packaged Flash Memory PRODUCT DESCRIPTION Part number E1116AEBG-8E-F is manufactured by ELPIDA and distributed by Stjk. As one of the leading distributors of electronic products,...
E1116ACBG-6E-E Packaging BGA Brand New Original Electronic Components BOM Distribution List Off The Shelf PRODUCT DESCRIPTION Part number E1116ACBG-6E-E is manufactured by ELPIDA and distributed by Stjk. As one...
EP1C4F324I7N Packaging BGA Embedded FPGA (Field Programmable Gate Array) Brand New Original Off The Shelf PRODUCT DESCRIPTION Part number EP1C4F324I7N is manufactured by ALTERA and distributed by Stjk. As one o...
Electronic Components FPGA Kintex-7 Family 162240 Cells 28nm Technology 1V 676-Pin BGA XC7K160T-2FFG676I Integrated Circuits Description : Xilinx 7 series FPGAs comprise three new FPGA families that address the...
Product Attribute Attribute Value Select Attribute Manufacturer: Micron Technology Product Category: NOR Flash Mounting Style: SMD/SMT Package / Case: BGA-64 Series: M29EW Memory Size: 1 Gbit Supply Voltage - M...
Counterfeit Inspection EMS BGA X Ray Machine For Electronics Components Application: Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electr...
5μm Microfocus X-ray with FPD 55° tilting view to inspect PCBA BGA QFN LED soldering void Application: Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Met...
SMT BGA X Ray Inspection Machine FPD Intensifier S7000 0.5kW Application: Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Conne...
Mirofocus X Ray Machine S7000 For BGA CSP QFN PCBA Soldering Application: Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connec...
1uSv/H Lithium Battery X Ray Inspection Equipment BGA CNC Mapping Application: Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic C...
5um SMT X Ray Equipment CNC Programmable For EMS BGA Voids Application: Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connecto...
SM662GEF BEST FLASH - NAND (TLC) Memory IC EMMC 100-BGA (14x18) Mfr Silicon Motion, Inc. Series Ferri-eMMC Product Status Active Memory Type Non-Volatile Memory Format FLASH Technology FLASH - NAND (TLC) Memor...
SM662PXF BESS FLASH - NAND (TLC) Memory IC EMMC 100-BGA (14x18) Mfr Silicon Motion, Inc. Series Ferri-eMMC Product Status Active Memory Type Non-Volatile Memory Format FLASH Technology FLASH - NAND (TLC) Memor...
484-BGA Package 10M50DAF484I6G 28.9 Gbps NRZ Field Programmable Gate Array IC Product Description Of 10M50DAF484I6G 10M50DAF484I6G integrate a monolithic 14 nm FPGA fabric die with multiple high-speed transceiv...
... Logic Cells, AI Core Versal, the package is BGA. Specification Of XCVC1502-2MLEVBVA Part Number: XCVC1502-2MLEVBVA I/O: 114 – 530 Speed: 400MHz, 1GHz Serial Bandwidth (Full Duplex) - ......
...DDR, DMA, PCIe. The package is BGA. Specification Of XCVC1502-2LSEVBVA Part Number: XCVC1502-2LSEVBVA Peripherals: DDR, DMA, PCIe Primary Attributes: Versal AI Core ......
... is BGA, AI Core Versal. Specification Of XCVC1502-2LLEVBVA Part Number: XCVC1502-2LLEVBVA AIE-ML Shared Memory: 0 Mb System Logic ......
... Cells XCVC1502-1MLIVSVG Field Programmable Gate Array 256KB BGA Package Product Description Of XCVC1502-1MLIVSVG XCVC1502-1MLIVSVG is Embedded System On Chip, the package is BGA, Connecting between the proc...
...Chip STM32F439NIH6 2MB Flash BGA-216 Package Product Description Of STM32F439NIH6 STM32F439NIH6 is a 32-bit RISC processor that features exceptional code-efficiency, delivering the high-performance expected ...