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... used in a wide range of applications such as industrial, automotive, and consumer electronics. They offer a range of package/case options, including QFP, BGA, TSSOP38, HTSSOP38, and TSOP48, and are availabl...
... array of applications. It is an essential component for many electronic products and systems, and can be used to amplify signals, process signals, and execute programs and commands. This chip is available i...
..., providing programmable interfaces, and controlling multiple peripherals. Our Electronic IC Chips are available in a variety of packages, including QFP, BGA, TSSOP38, HTSSOP38, and TSOP48, and come in vario...
.... It is also used as an amplifier IC, buck switching regulator IC, driver IC and memory IC. It is available in packages/cases such as QFP, BGA, TSSOP38, HTSSOP38 and TSOP48. It supports current of 1A, 2A and...
...: Our Electronic IC Chip is a type of electronic components IC chips with a wide range of applications. It provides a variety of frequency options, such as 100MHz, 200MHz, 300MHz, and various packages/cases,...
DRV8432DKDR DRV8432DKD DRV8432 HTSSOP36 IC Car CPU BGA Chipest,Car Module ICS Chips Automotive chips DRV84x2Dual Full-Bridge PWM Motor Driver Description The DRV841x2 are high-performance,integrated dual full-b...
EP4CE30F23I7N BGA-484 New and origianl parts IC chips In Stock EP4CE30F23C8N EP4CE30F23C6N EP4CE30F23I7N Mfr. #: EP4CE30F23I7N Specification: Description FPGA - Field Programmable Gate Array FPGA - Cyclone ......
EP2S180F1020I4N BGA Components New Original Tested Integrated Circuit Chip IC EP2S180F1020I4N To better ensure the safety of your goods, professional, environmentally friendly, convenient and efficient packagin...
...locksmiths who need reliable key replacement. Packaging: 1. All cargos are packaged in one box. 2. Every shipping ,we will package with bubble to wrap valuables, then put into cartons. 3. We support for envi...
...BGA / Finihsed treatment immersion gold and apply for AI equipment A rigid-flex circuit board is a 3D interconnect that can be bent and folded into almost any shape. Rigid-flex technology allows designers to...
...BGA / Finihsed treatment immersion gold and apply for AI equipment A rigid-flex circuit board is a 3D interconnect that can be bent and folded into almost any shape. Rigid-flex technology allows designers to...
Small Mobile Ic Chip Removal Machine WDS-580 For Iphone 5s Repair Product Description Specification: Total Power 4800W Upper Heating Power 800W Lower Heating Power 1200W Infrared Heating Power 2700W(1200W is co...
Features Optimized for 1.8V systems - As fast as 5.7 ns pin-to-pin delays - As low as 13 A quiescent current Industrys best 0.18 micron CMOS CPLD - Optimized architecture for effective logic synthesis - M...
Introduction of XCR3256XL-12PQ208C Features Low power 3.3V 256 macrocell CPLD 7.0 ns pin-to-pin logic delays System frequencies up to 154 MHz 256 macrocells with 6,000 usable gates Available in small ...
Introduction of XC95288XL-10PQG208C Features 6 ns pin-to-pin logic delays System frequency up to 208 MHz 288 macrocells with 6,400 usable gates Available in small footprint packages - 144-pin TQFP (117 ...
Product: ADSP-21371BSWZ-2B Description: This is a 32-bit Digital Signal Processor (DSP) designed for mixed-signal applications. Features: 32-bit fixed-point DSP architecture 512K x 32-bit internal memory ...
RF Mixer SA605D SA605 NE605 SOP20 SA605DK SA605 TSSOP-20 IC Original in stock Model Package Date STM32F407ZET6 LQFP144 2020+/2019+ ADM2587EBRWZ-REEL7 SOP-20 2020+ LAN8720A-CP-TR QFN24 2020+ STM32F401RCT6 LQFP64...
NB7L1008MMNG NB7L1008 NB7L 1008M QFN New parts Electronic component New parts Electronic component Model Package Date STM32F407ZET6 LQFP144 2020+/2019+ ADM2587EBRWZ-REEL7 SOP-20 2020+ LAN8720A-CP-TR QFN24 2020+...
Stock Offer (Hot Sell) Part no. Quantity Brand D/C Package ADXRS300ABG 2045 AD 14+ GBA AZ78L09RTR 5000 BCD 14+ SOT89 BAV99WT1G 5000 ON 14+ SOT-323 BC857C 5000 16+ SOT-23 FR105 5000 MIC 16+ DO-41 KTC3875S-Y-RTK/...