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original new BOM Microcontroller MCU IC BGA-292 SAK-TC387QP-160 F300S SAK-TC387QP-160F300S AD AE A microcontroller (MCU) IC (Integrated Circuit) is a type of electronic component that incorporates a central pro...
Automatic Soldering Robot for LSI IC BGA DVD Audio Equipment and More with Iron Head Alignment Specification Model HS-S331R/HS-DS331R Voltage AC110V/220V,......
Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0...
Application:Semiconductor,IC package,IC assembly,Semi packaging,IC substrate,wearable electronics,Nand/Flash memory spackage; Spec.of Substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0...
BT IC AB1526P BT 5.0 Dual Mode Chip AB1526 Audio Single Chip BGA Package Product Description AB1526P is an advanced single-chip solution which integrates baseband and radio for intensive audio applications. It ...
...Iphone IC Chip 339S01013 Iphone Macbook AIR/WiFi /BT 5.0 Module Product Description Of 339S01013 339S01013 is low power Iphone Macbook AIR/WiFi /BT 5.0 module. Specification Of 339S01013 Part Number: 339S010...
... IC Product Description Of BCM89531B1BPBG BCM89531B1BPBG is second generation of fully integrated BroadR-Reach® multilayer switch solutions to support automotive qualification. Specification Of BCM89531B1BPB...
...IC Product Description Of 88Q2221MA0-NYA2A0G1 88Q2221MA0-NYA2A0G1 transceiver implements the Ethernet physical layer portion of 1000BASE-T1 as defined by the IEEE 802.3bp standard. Specification Of 88Q2221MA...
... supporting Managed Flash Revision 5.1 Standard. It has a total memory capacity of 8GB and comes in a 153 ball BGA package. It is build of MLC technology NAND Flash (1 dies of 64Gb inside) and is made for an...
Product Listing: NLVX2G16AMUTCG - Electronic Components IC Chips Product Parameters: - Power Consumption: 0.9W - Supply Voltage Range: 1.8V-3.6V - Operating Temperature Range: -40C to +85C - Package Type: BGA...
...IC Chip High Performance Integrated Circuit Chip Product Listing: CY14V101LA-BA45XIT Product Description: This is an integrated circuit chip from Cypress Semiconductor. The chip is a 128K x 8 nonvolatile CMO...
Product Listing: Product Name: 5CEFA7F23I7N Power Management IC Package Type: BGA Number of Pins: 7 Input Voltage Range: 3.3V - 20V Output Voltage Range: 0.8V - 4.3V Output Current: Up to 4A ......
Product Listing: EP3C10F256C8N Programmable IC Chip Features: • 256-Pin Fine-Pitch BGA package • Up to 100 MHz maximum operating frequency • Up to 8 Kbits of SRAM • Up to 8 Kbits of embedded Flash Memory • Up t...
... - High speed LVDS/LVPECL/HCSL I/Os - PLLs Package: - 456-pin flip chip BGA Operating Voltage: - 1.14V to 1.26V Operating Frequency: - Up to 200MHz Temperature Range: - 0°C to 85°C Why buy from us >>> Fast /...
Product Listing: EP3C5F256C8N Programmable IC Chip Specifications: Package: 144-Pin Fine-Pitch BGA Technology: Cyclone III Supply Voltage (VCC): 1.2V (Core), 3.3V (I/O) Number of Logic Elements: 25,000 ...
Product Listing: Product: Programmable IC Chip, EP3C16F484I7N Parameters: - Package Type: 176-Pin Fine-Pitch BGA - Core: Cyclone III - Number of Logic Elements: 19,200 - Maximum User I/Os: 176 - System Gates: 6...
XC6SLX16-3CSG324C Programmable IC Chip Product Features: - Xilinx Spartan 6 FPGA family with 16k logic cells and up to 1.2 Mbits of embedded block RAM - 324-pin FineLine BGA package with a wide range of I/O fea...
... Voltage - Supply 1.14V ~ 1.26V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 400-BGA Supplier Device Package 400-FBGA (21x21) Base Product Number XC3S400 XC3S400A-4FGG400C...
...IC Chip 320-FBGA Package Wide Frequency Range FPGA Number of LABs/CLBs 896 Number of Logic Elements/Cells 8064 Total RAM Bits 368640 Number of I/O 251 Number of Gates 400000 Voltage - Supply 1.14V ~ 1.26V Mo...
... ~ 1.05V Mounting Type Surface Mount Operating Temperature 0°C ~ 85°C (TJ) Package / Case 484-BGA Supplier Device Package 484-FPBGA (23x23) XC7S50-1FGGA484C • Advanced high-performance FPGA logic based on re...