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...CY62167DV30LL-55BVXI CY62256LL-55SNI Category Integrated Circuits (ICs) Product Name Electronic components Model number CY62157EV30LL-45BVXIT CY62167DV30LL-55BVXI CY62256LL-55SNI Mfr FAIRCHILD Series IC Comp...
...IC BCM89559GB0BCFBG Secure Automotive Ethernet Switch IC Product Description Of BCM89559GB0BCFBG BCM89559GB0BCFBG is a highly-integrated BroadR-Reach® multilayer switch device designed for in-vehicle network...
...Bits: 1Bit,Terminal Position: BOTTOM,Packaging: Tape & Reel (TR),Receiver Number of Bits: 1Bit Driver ICs with enhanced 36-VFBGA packages are excellent for driving LEDs with common characteristics.There is a...
Application:FC package substrate,FlipChip substrate,Flipchip CSP,.FBGA/LGA/PBGA/WBGA substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line spac...
...IC package substrate pcb For eMMC IC assembly package substrate pcb, BGA ,Gold plating,0.2mm finished,FR4 material,green soldermask (support customized),Use for wearable electronics,UAV,house electronics,con...
...IC package substrate pcb For Storage IC assembly package substrate pcb, BGA ,Gold plating,0.2mm finished,FR4 material,green soldermask (support customized),Use for wearable electronics,UAV,house electronics,...
XR2P-1641 Digi-Ic New Original Integrated Electronic Components BOM IC Find information here in stock.xlsx Product Attributes TYPE DESCRIPTION Category Connectors, Interconnects Rectangular Connectors Headers, ...
...: DC 5V 2.1A Provides rapid charging for electronic devices—1A suitable for phones and 2.1A designed for tablets. Built-in IC chip ensures protection against...
... and thin matrix trays to handle various QFP, PGA, BGA and other custom devices. If a new tray design is required, we provide expert design services to develop the best tray to meet your needs, and ......
... is a kind of high-temperature resistant IC tray made of PES and the injection molding process. The JEDEC tray is a carrier used by semiconductor chip companies for packaging and baking tests of their ......
... Manager IC Product Description Of APL109D/343S00555 APL109D/343S00555 is high performance low power Iphone Macbook AIR/performance manager ic. Specification Of APL109D/343S00555 Part Number: APL109D/343S005...
...IC VSC7427XJG-02 26 Port Managed Layer 2-Ethernet Switch IC Product Description Of VSC7427XJG-02 VSC7427XJG-02 is pin-compatible devices with port countsranging from 10 Gigabit Ethernet ports to 26 Gigabit E...
...IC VSC7552TSN-V/5CC Telecom IC Ethernet Switch 888-FCBGA Product Description Of VSC7552TSN-V/5CC VSC7552TSN-V/5CC is a 64 Gbps to 200 Gbps Industrial Ethernet switch family supporting a wide variety of confi...
...-03 Function Ethernet Number of Circuits 1 Voltage - Supply 1V Mounting Type Surface Mount Package / Case 672-BGA Features Of VSC8512XJG-03 Support for...
Original IC Memory Chip K3KL9L90CM-MGCT Integrated Circuit Products Specifications Category Integrated Circuits (ICs)/Memory/Memory (ICs) Manufacturer SAMSUNG Package BGA-315 Memory Size 64Gbit Voltage - Supply...
...:DDR substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage; Spec.of pcb production: Mini.Line space/width:1mil (25um) Finished thickn...
Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap...
Application: FCBGA package, FCCSP package, NandFlash memory substrate,Semi Package,Semiconductors ,Semiconductor,IC package,IC substrate,uMCP,MCP,UFS,CMOS,MEMS,IC assembly,Storage IC substrage;Smart phone -.Lap...
IS42S32800J-6BLI-TR ISSI DRAM 256M, 3.3V, SDRAM, 8Mx32, 166Mhz, 90 ball BGA (8mmx13mm) RoHS, IT, T&R...
Unicomp AX7900 90kV X ray inspection machine for SMT BGA soldering void IC quality inspection Description: 90KV 5μm X-ray tube, FPD Detector. Multi-function workstation, XY multi-axis movement ......