Heat Resistant PES Black JEDEC Trays For IC Chip SGS Certified
Our JEDEC tray series is tailored for QFP, BGA, and other IC
packages, ensuring secure positioning during high-speed processes.
HN21090 is a kind of high-temperature resistant IC tray made of PES
and the injection molding process. The JEDEC tray is a carrier used
by semiconductor chip companies for packaging and baking tests of
their chips. Because the tray can be in a 120℃-220℃ different bake
environment without deformation characteristics, it is commonly
known as 'high temperature tray' in the electronics industry.
Details about The HN21090 Heat Resistant PES Black JEDEC Trays For
IC Chip
The JEDEC tray has good heat resistance and can be used
continuously at temperatures of 180°C to 200°C. In the temperature
range below 180°C, its melting resistance is one of the most
excellent thermoplastic resins. At the same time, in terms of
environmental protection and health, it meets the requirements of
ROHS and halogen-free environmental protection. The 18*8 matrix can
also load more products, which greatly reduces the transportation
cost for customers.
Application:
Electronic Component, Embedded System, Sensor, Test and Measurement Technology
Technical Parameters:
| Brand | Hiner-pack | Outline Line Size | 322.6*135.9*12.5mm |
| Model | HN21090 | Cavity Size | 9.4*10.4*4.09mm |
| Package Type | N/A | Matrix QTY | 8*18=144PCS |
| Material | PES | Flatness | MAX 0.76mm |
| Color | Black | Service | Accept OEM, ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | RoHS |
Advantages:
1. Lightweight, saving transportation and packaging costs;
2. Good anti-static performance, effectively ensures that the
product is not damaged by anti-static release;
3. High temperature resistance, suitable for high temperature
automation equipment assembly;
4. Corrosion resistance, suitable for all kinds of production
conditions of products;
5. Matrix arrangement design, under the premise of protecting the
product, the maximum capacity design, and cost saving.
6. Edge chamfer design effectively prevents stacking errors and
corrects the direction of placement.
FAQ:
Q1: Are you a manufacturer?
Ans: Yes, we are a 100% manufacturer specialized in packaging for
over 12 years with a 1500 square meter workshop area, located in
Shenzhen, China.
Q2: What information should we supply if we want a quotation?
Ans: Drawing of your IC or component, Quantity, and size normally.
Q3: How long could you prepare samples?
Ans: Normally, 3 days. If customized, open a new mold 25~30 days
around.
Q4: How about batch order production?
Ans: Normally 5- 8 working days or so.
Q5: Do you inspect the finished products?
Ans: Yes, we will inspect according to the ISO 9000 standard and be
ruled by our QC staff.
