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FPD 100KV X Ray Inspection System For Capacitor Function & Features Large Size Inspection Table Laser Locator for Precise Location 24 FHD Interactive Touch LCD Display Accurate Control, CNC ProgrammingAutomat...
Micro Focus Electronics X Ray System For Capacitor Internal Defects Control Application Fields Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casti...
Factory manufacturer of 90kV closed tube 5 um high resolution X-ray equipment for electronics Cable connector harness broken crack twrist quality inspection Application Fields Widely applied for BGA , CSP , Fli...
X-Ray Inspection Equipment Product Description: Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Aerospac...
Unicomp X-ray AX9100vs Multi-mode 3D Micro-focus X-ray Analyze Inspection System Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Cerami...
Unicomp X-ray AX8300 Plus Semiconductor Microfocus X-ray Inspection Equipment Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic p...
Unicomp X-ray AX8300VS Multi-mode 3d Micro-focus X-ray Analyze Inspection System Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Cerami...
Boost y assembly line efficiency with compact tabletop pick and place machine HWGC High speed HW-DSQ800-120F pick and place machine Smt pcb production assembly pasted 0201 BGA smt aoi machine 8 groups of indepe...
...-oven. It can be used for effectively soldering various SMD and BGA components. The whole soldering process can be completed automatically and it is very easy to use. This machine uses a powerful infrared em...
X Ray Detection Equipment , BGA Void Inspection Machine 220AC / 50Hz Application: This X Ray Detection Equipment suits for Inpestion of BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Indus...
... In-circuit Test Function Test Min Chip 0201 chip Glue,Burn-in Conformal Coating Fine-pitch 0.20mm BGA Re-work BGA ball size 0.28mm H 高 ◆SMT+ICT+THT+FT ◆SMT+ICT+THT+Harness+Assembly+FT ◆SMT machine(for...
...circuit Test Function Test Min Chip 0201 chip Glue,Burn-in Conformal Coating Fine-pitch 0.20mm BGA Re-work BGA ball size 0.28mm Technology Involved: H 高 ◆SMT+ICT+THT+FT ◆SMT+ICT+THT+Harness+Assembly+FT ◆SMT ...
...circuit Test Function Test Min Chip 0201 chip Glue,Burn-in Conformal Coating Fine-pitch 0.20mm BGA Re-work BGA ball size 0.28mm Technology Involved: H 高 ◆SMT+ICT+THT+FT ◆SMT+ICT+THT+Harness+Assembly+FT ◆SMT ...
...circuit Test Function Test Min Chip 0201 chip Glue,Burn-in Conformal Coating Fine-pitch 0.20mm BGA Re-work BGA ball size 0.28mm Technology Involved: H 高 ◆SMT+ICT+THT+FT ◆SMT+ICT+THT+Harness+Assembly+FT ◆SMT ...
...circuit Test Function Test Min Chip 0201 chip Glue,Burn-in Conformal Coating Fine-pitch 0.20mm BGA Re-work BGA ball size 0.28mm Technology Involved: H 高 ◆SMT+ICT+THT+FT ◆SMT+ICT+THT+Harness+Assembly+FT ◆SMT ...
...circuit Test Function Test Min Chip 0201 chip Glue,Burn-in Conformal Coating Fine-pitch 0.20mm BGA Re-work BGA ball size 0.28mm Technology Involved: H 高 ◆SMT+ICT+THT+FT ◆SMT+ICT+THT+Harness+Assembly+FT ◆SMT ...
...Machine Spare Parts Test in machine before shipping: Product Advantages: An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may h...
...place machinery HWGC High speed HW-DSQ800-120F pick and place machine Smt pcb production assembly pasted 0201 BGA smt aoi machine 8 groups of independent mounting heads - 8 groups of mounting heads are distr...
... + / - 0.05 mm The patch stance: 48 Capacity assessment Element range: 0201-24 mm QFP, PLCC, SOP, BGA, etc Theory: 36000 components per hour Actual: about 25200 components per hour Equipment size: 980 * 1660...