| Sign In | Join Free | My burrillandco.com |
|
Detailed Product Description Blue Solder Mask BGA Multi Layer PCB Printed Circuit Board Assembly Characteristics: 1. Professional PCB manufacturer. 2. PCBA,OEM,ODM service are provided. 3. Gerber file needed. 4...
...Automobile PCB , Green Solder Mask , ENIG PCB Specifications: Layer Count: 10 Layer HDI PCB Board Thickness: 1.8MM Material: FR4 High Tg Min Hole: 0.1MM Min Line: 5/4 Mil BGA: 16Mil Hole: L1-L2, L2-L3, L2-L9...
...: T962C Effective Soldering max area: 400 x 600mm Rated power: 2500W Temperature Range: 0°C-280°C Process cycle: 1~8 min Voltage: 110V~......
... + Infrared 2500w Reflow Oven BRT-420 300*300mm BGA SMD SMT Rework Sation Ship by DHL express door to door, it takes 4-7 days arrive Description of BRT-420 Reflow Oven: Soldering max area: 300*300CM Solderin...
Multilayer Printed Circuit Board 8 Layer Printed Circuit Board With Small Line Space And BGA Black Solder Mask 8 Layer Printed Circuit Board with Small line space and BGA HSX Circuit covers over 5,000 PCB produ...
...solder mask and immersion gold treatment. 3 Min hole size is 0.1mm and min BGA size is 10 mil. 4 Finished board thickness is 0.8 mm. 5 The production cost will be higher than normal multilayer pcb and lead t...
...BGA IPC ENIG 1u' 6 Layer PCB PCB Specifications: Part NO: 06B2105042 Layers: 6Layer Surface Finished: Immersion gold 1u' Material: FR4 Thickness: 1.6mm PCB Size: 166.16mm*330mm Finished copper: 1OZ Solder Ma...
...solder mask and immersion gold treatment. 3 Min hole size is 0.1mm and min BGA size is 10 mil. 4 Finished board thickness is 0.8 mm. 5 The production cost will be higher than normal multilayer pcb and lead t...
...BGA IPC ENIG 1u' 6 Layer PCB PCB Specifications: Part NO: 06B2105042 Layers: 6Layer Surface Finished: Immersion gold 1u' Material: FR4 Thickness: 1.6mm PCB Size: 166.16mm*330mm Finished copper: 1OZ Solder Ma...
...Soldering Machine/New design LED Reflow oven soldering machine No. Scope of application 1 Suitable for solder paste type Lead-free solder, ordinary solder, red glue 2 Processing the maximum substrate size (M...
...Soldering Machine/New design LED Reflow oven soldering machine No. Scope of application 1 Suitable for solder paste type Lead-free solder, ordinary solder, red glue 2 Processing the maximum substrate size (M...
...bga Infrared IC Heater desktop reflow oven Puhui smt small soldering wave oven Specification: 1.reflow oven T-962A IR lead-free reflow oven Power supply:AC110V/ 50Hz AC220V /60Hz Rated power:1500W Maximum So...
...Solder Voiding Analysis UNICOMP AX8300MAX This advanced industrial X-ray inspection system is specifically designed for precision analysis of IGBT solder voiding and comprehensive quality verification of ele...
...Touch Screen 3 Heating Zones Manual BGA Rework Station with & CE Introduction: A BGA Rework Station is a specialized tool used in the electronics manufacturing industry to repair or replace Ball Grid Array (...
...repairing and reworking Ball Grid Array (BGA) components on mobile phone circuit boards. These stations are crucial in the electronics repair industry, especially for repairing smartphones and other portable...
... reflow oven reflow soldering machine RF1020PC Product name: 10 zone Large reflow soldering oven Product features: Imported heating components, temperature uniformity, compensation of high efficiency, suitab...
... uniformity, high efficiency thermal compensation for CSP, BGA component soldering; 2 Dedicated wind turbine design, ventilation volume, wind speed and stability; Independent of the temperature zone using fo...
...soldering oven machine for SMT line 8820PC Product name: 8 zone Large reflow soldering oven 8820PC Model: 8820PC Product features: 1 Use of imported heating components, temperature uniformity, high efficienc...
... soldering oven Product name: Large size 8 zone reflow soldering oven 8820PC Model: 8820PC with rail Product features: 1 Use of imported heating components, temperature uniformity, high efficiency thermal co...
... ) GL865-QUAD he new GE865 product family introduces the smallest GSM/GPRS Ball-Grid-Array (BGA) modules in the market. The low profile and small size of the unique BGA package for the GE865-QUAD enable the ...