10 Layer HDI Printed Circuit Board , Automobile PCB , Green Solder
Mask , ENIG
PCB Specifications:
Layer Count: 10 Layer HDI PCB
Board Thickness: 1.8MM
Material: FR4 High Tg
Min Hole: 0.1MM
Min Line: 5/4 Mil
BGA: 16Mil
Hole: L1-L2, L2-L3, L2-L9, L8-L9, L9-L10, L1-L10 0.2MM
Solder Mask: Green
Surface Treatment: Immersion Gold
Application: Automobile Control Board
Capabilities:
| Item | Capability |
| Layer Count | 1-24 Layers |
| Board Thickness | 0.1mm-6.0mm |
| Finished Board Max Size | 700mm* 800mm |
| Finished Board Thickness Tolerance | +/-10% +/-0.1(<1.0mm) |
| Warp | <0.7% |
| Major CCL Brand | KB/NanYa/LTEQ/ShengYi/Rogers Etc |
| Material Type | FR4,CEM-1,CEM-3,Aluminum,Copper,Ceramic, PI, PET |
| Drill Hole Diameter | 0.1mm-6.5mm |
| Out Layer Copper Thickness | 1/20Z-8OZ ; |
| Inner Layer Copper Thickness | 1/3OZ-6OZ |
| Aspect Ratio | 10:1 |
| PTH Hole Tolerance | +/-3mil |
| NPTH Hole Tolerance | +/-1mil |
| Copper Thickness Of PTH Wall | >10mil(25um) |
| Line Width And Space | 2/2mil |
| Min Solder Mask Bridge | 2.5mil |
| Solder Mask Alignment Tolerance | +/-2mil |
| Dimension Tolerance | +/-4mil |
| Max Gold Thickness | 200u'(0.2mil) |
| Thermal Shock | 288C, 10s, 3 Times |
| Impedance Contro | +/-10% |
| LTest Capability | PAD Size Min 0.1mm |
| Min BGA | 7mil |
| Surface Treatment | OSP, ENIG, HASL, Plating Gold, Carbon Oil,Peelable |
FAQ:
Questions:What is Solder Paste?
Answer:
Solder Paste is a form of solder than can be easily applied on a
Printed Circuit Board. It has a viscous state and is grey in color.
The paste consists of a combination of tiny balls of solder and
flux mixed together to form a paste. It is applied to the pads on a
PCB where electronic components need to be placed. When heated this
paste melts to form a connection between the pads and the leads of
electronic components placed on the PCB.
Solder paste is used during the PCB assembly process. The paste is
applied on the PCB Board using a solder paste printer, in a process similar to screen printing i.e a stencil is placed
over the PCB and then the solder is applied over the board using a
solder paste printer. The components are then placed on the board.
The viscosity of the paste helps keeps the components in place as
the board is moved around or as the board is passed from the
component placement section to the reflow oven using a conveyor belt. Once in the reflow oven, based on the
thermal provide of the solder paste it melts and when cooled
resulted in a soldered connection between the pads on the PCB and
the leads of the electronic component.
Solder Paste is usually used for soldering Surface Mount Components
on a PCB, however, this can also be used to solder thru-hole
components by applying this paste using a brush or via an
injection.
Solder Paste Storage
Solder paste should be stored in an airtight container to prevent
oxidation and should be stored at low temperatures (but should not
lower than freezing temperature) to prevent the flux degradation.
Composition of solder paste:
Solder paste is the mixture of tiny solder balls and solder flux.
Depending upon the application, the solder ball's composition will
vary. The Solder paste is mixed using solder paste mixers.
