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4 Layer PCB Hdi Printed Circuit Boards With Blind Buried Half Holes OSP+ENIG

    Buy cheap 4 Layer PCB Hdi Printed Circuit Boards With Blind Buried Half Holes OSP+ENIG from wholesalers
     
    Buy cheap 4 Layer PCB Hdi Printed Circuit Boards With Blind Buried Half Holes OSP+ENIG from wholesalers
    • Buy cheap 4 Layer PCB Hdi Printed Circuit Boards With Blind Buried Half Holes OSP+ENIG from wholesalers
    • Buy cheap 4 Layer PCB Hdi Printed Circuit Boards With Blind Buried Half Holes OSP+ENIG from wholesalers
    • Buy cheap 4 Layer PCB Hdi Printed Circuit Boards With Blind Buried Half Holes OSP+ENIG from wholesalers
    • Buy cheap 4 Layer PCB Hdi Printed Circuit Boards With Blind Buried Half Holes OSP+ENIG from wholesalers
    • Buy cheap 4 Layer PCB Hdi Printed Circuit Boards With Blind Buried Half Holes OSP+ENIG from wholesalers
    • Buy cheap 4 Layer PCB Hdi Printed Circuit Boards With Blind Buried Half Holes OSP+ENIG from wholesalers

    4 Layer PCB Hdi Printed Circuit Boards With Blind Buried Half Holes OSP+ENIG

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    Brand Name : WITGAIN PCB
    Model Number : S04E3698A0
    Certification : UL Certificate
    Price : negotiable
    Payment Terms : T/T
    Supply Ability : 1kkpcs/month
    Delivery Time : 25 work days
    • Product Details
    • Company Profile

    4 Layer PCB Hdi Printed Circuit Boards With Blind Buried Half Holes OSP+ENIG

    4 Layer Printed Circuit Board With Blind And Buried Holes , Half Hole PCB , OSP+ENIG


    4 Layer Printed Circuit Board With Blind And Buried Holes


    PCB Specifications:


    Layer Count: 4Layer Half Plated Hole PCB

    Board Thickness: 1.0MM

    Material: FR4

    Copper Thickness: 1/H/H/1OZ

    Min Hole: 0.1MM

    Min Line: 3/3 Mil

    BGA Size: 8Mil

    Unit Size: 82*109.6MM/20UP

    Hole: L1-L4, L2-L3, L3-L4, L1-L2

    Min Distance Between Inner Layer Line to Holes: 5Mil

    Solder Mask: Green

    Surface Treatment: ENIG+OSP(OSP for BGA Pads)

    Special Treatment: Half Plated Holes

    Application: GPS Module


    Capabilities:


    ItemCapability
    Layer Count1-24 Layers
    Board Thickness0.1mm-6.0mm
    Finished Board Max Size700mm* 800mm
    Finished Board Thickness Tolerance+/-10% +/-0.1(<1.0mm)
    Warp<0.7%
    Major CCL BrandKB/NanYa/LTEQ/ShengYi/Rogers Etc
    Material TypeFR4,CEM-1,CEM-3,Aluminum,Copper,Ceramic, PI, PET
    Drill Hole Diameter0.1mm-6.5mm
    Out Layer Copper Thickness1/20Z-8OZ ;
    Inner Layer Copper Thickness1/3OZ-6OZ
    Aspect Ratio10:1
    PTH Hole Tolerance+/-3mil
    NPTH Hole Tolerance+/-1mil
    Copper Thickness Of PTH Wall>10mil(25um)
    Line Width And Space2/2mil
    Min Solder Mask Bridge2.5mil
    Solder Mask Alignment Tolerance+/-2mil
    Dimension Tolerance+/-4mil
    Max Gold Thickness200u'(0.2mil)
    Thermal Shock288C, 10s, 3 Times
    Impedance Contro+/-10%
    LTest CapabilityPAD Size Min 0.1mm
    Min BGA7mil
    Surface TreatmentOSP, ENIG, HASL, Plating Gold, Carbon Oil,Peelable


    FAQ:


    Question: What is the most common quality issue for this kinf of pcb?

    Answer: 1) Copper burr in half holes

    2) Oxidation in half holes


    Question: Why use surface treatment ENIG+OSP?

    Answer: OSP has good tin solder paste feature . The BGA size is only 8mil. If use immersion gold, it's not good for tin solder paste. So we suggest customer to use ENIG+OSP. It can protect other pads well and meanwhile, it makes sure that the BGA pads have good tin solder paste feature.


    Question: Is the cost for ENIG+OSP higher than ENIG?

    Answer: Yes it is. But it won't make a big difference.


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