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8 Layer HDI Pcb Fabrication Service 1.0MM FR4 IT180A Material Half Hole

    Buy cheap 8 Layer HDI Pcb Fabrication Service 1.0MM FR4 IT180A Material Half Hole from wholesalers
     
    Buy cheap 8 Layer HDI Pcb Fabrication Service 1.0MM FR4 IT180A Material Half Hole from wholesalers
    • Buy cheap 8 Layer HDI Pcb Fabrication Service 1.0MM FR4 IT180A Material Half Hole from wholesalers
    • Buy cheap 8 Layer HDI Pcb Fabrication Service 1.0MM FR4 IT180A Material Half Hole from wholesalers
    • Buy cheap 8 Layer HDI Pcb Fabrication Service 1.0MM FR4 IT180A Material Half Hole from wholesalers
    • Buy cheap 8 Layer HDI Pcb Fabrication Service 1.0MM FR4 IT180A Material Half Hole from wholesalers
    • Buy cheap 8 Layer HDI Pcb Fabrication Service 1.0MM FR4 IT180A Material Half Hole from wholesalers
    • Buy cheap 8 Layer HDI Pcb Fabrication Service 1.0MM FR4 IT180A Material Half Hole from wholesalers
    • Buy cheap 8 Layer HDI Pcb Fabrication Service 1.0MM FR4 IT180A Material Half Hole from wholesalers

    8 Layer HDI Pcb Fabrication Service 1.0MM FR4 IT180A Material Half Hole

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    Brand Name : WITGAIN PCB
    Model Number : S08EO4429A0
    Certification : UL Certificate
    Price : negotiable
    Payment Terms : T/T
    Supply Ability : 1kkpcs/month
    Delivery Time : 25 work days
    • Product Details
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    8 Layer HDI Pcb Fabrication Service 1.0MM FR4 IT180A Material Half Hole

    8 Layer HDI Printed Circuit Board , Blind And Buried Holes , 1.0MM , FR4 IT180A Material


    8 Layer Printed Circuit Board With Blind And Buried Holes


    PCB Specifications:


    Layer Count: 4Layer Half Plated Hole PCB

    Board Thickness: 1.0MM

    Material: FR4 IT180A

    Min Hole: 0.1MM

    Min Line: 3/3 Mil

    BGA Size: 8Mil

    Unit Size: 122*114MM/12UP

    Blind Holes: L1-L2 , L7-L8 0.1MM

    Buried Holes: L2-L3 , L6-L7 0.1MM , L3-L6 0.2MM

    Via Holes: L1-L8 0.8MM

    Min Distance Between Inner Layer Line to Holes: 6Mil

    Solder Mask: Green

    Surface Treatment: ENIG+OSP(OSP for BGA Pads)

    Special Treatment: Half Plated Holes

    Application: GPS Module


    Other PCB Show:



    FAQ:


    Question: What is the most common quality issue for this kinf of pcb?

    Answer: 1) Copper burr in half holes

    2) Oxidation in half holes


    Question: Why use surface treatment ENIG+OSP?

    Answer: OSP has good tin solder paste feature . The BGA size is only 8mil. If use immersion gold, it's not good for tin solder paste. So we suggest customer to use ENIG+OSP. It can protect other pads well and meanwhile, it makes sure that the BGA pads have good tin solder paste feature.


    Question: Is the cost for ENIG+OSP higher than ENIG?

    Answer: Yes it is. But it won't make a big difference.

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