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...BGA Soldering Void Qual Features: ● 90-130KV 7μm X-Ray tube. ● High speed & Millions pixels high resolution FPD. ● 1000X magnification, high-definition real-time image. ● One-button operation with 2.5D image...
Tilt BGA Solder Joint Electronics Xray Inspection Machine AX8300MAX Unicomp Auto Void Analysis Application This system is widely applicable to semiconductor packaging (BGA, CSP, LED, Flip Chip), automotive part...
WDS-650 motherboard reballing mahcine, reballing motherboard kit help repair shoper make repairing easily Application of WDS-650 Laptop / Notebook/ Computer motherboard repair. Playstation / XBOX 360 and ot...
709A handheld battery spot welder + T338D Rechargeable battery parameter intelligent tester 1.The machine is a combination of battery spot welding and circuit board solder, which makes your work more convenient...
719A handheld precision battery spot welder + internal resistance of the battery capacity test 1.The machine is a combination of battery spot welding and circuit board solder, which makes your work more conveni...
...soldering of BGA CSP components. · The patent wind wheel design can ensure wind speed windspeed can be adjusted by frequency conversion · All temperature zone ......
...condition of the oven the parameter of the oven can be modified at any moment 3. Even temperature and high heat compensation efficiency, especially suitable for soldering of BGA CSP components. 4. Smart cont...
...Solder Ball Nozzle The precision-manufactured 450µm solder ball nozzle, through nano-scale aperture processing and mirror-finished flow channel treatment, completely solves the wear and clogging problems of ...
... Type Water Soluble Solder Paste,Leaded and Lead-Free 3 Components Passives Down to 0201 Size BGA and VFBGA Leadless Chip Carries/CSP Double-Sided SMT Assembly Fine Pitch to 08 Mils BGA Repair and Reball Par...
... used to clean flux solder baslls... on PCBA, such as: rosin flux, water-soluble flux , non-clean flux ,solder paste and other organic and inorganic contaminations. SME-5600 features: 1. Diffirent types of f...
...Pitch 0.2mm Minimum chip size 0201(0.2x0.1)/0603(0.6x0.3mm) Maximum BGA size 74x74mm BGA ball pitch 1.00mm(minimum), 3.00mm(maximum) BGA ball diameter 0.40mm(minimum), 1.00mm(maximum) QFP lead pitch 0.38mm(m...
Pulse Battery Spot Welder 787A+LED light 1. Adopt advanced precise MCU current controller to achieve precise micro-computer soldering. 2. Adopt wider current range and single/double pulse soldering model to sel...
Pulse Battery Spot Welder 787A+LED light+T338D Rechargeable battery parameter intelligent tester 1. Adopt advanced precise MCU current controller to achieve precise micro-computer soldering. 2. Adopt wider curr...
SMT Lead Free Reflow Soldering Machine RF-H600 I Reflow Oven Features Even temperature and high heat compensation efficiency,especially suitable for soldering of BGA CSP components. · The patent wind wheel desi...
...Soldering Machine RF-700I Features 1. The guide rail is made of special aluminum alloy with high rigidity accuracy and intensity, with auto chain lubricating system. 2. Even temperature and high heat compens...
...soldering of BGA CSP components. 2. The patent wind wheel design can ensure wind speed windspeed can be adjusted by frequency conversion 3. All temperature zone ......
... Foreign Objects,Loss ofAluminum, Overlapping Solder Joints, Damaged Protective Coating,BrokenSolder Joints, Loss of Gold in Gold Fingers, Large Flat Balls,Unsoldered← Wires, soldering wrong wires, missing s...
...soldering is a key process in SMT production, and a reasonable temperature profile is the key to ensuring reflow quality. Inappropriate temperature profiles can cause soldering defects such as incomplete sol...
... and Thru-hole 2 Solder Type Water Soluble Solder Paste,Leaded and Lead-Free 3 Components Passives Down to 0201 Size BGA and VFBGA Leadless Chip Carries/CSP Double-Sided SMT Assembly Fine Pitch to 08 Mils BG...
... and Thru-hole 2 Solder Type Water Soluble Solder Paste,Leaded and Lead-Free 3 Components Passives Down to 0201 Size BGA and VFBGA Leadless Chip Carries/CSP Double-Sided SMT Assembly Fine Pitch to 08 Mils BG...