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Total 1197 products for bga solder ball Manufacture & Suppliers

0.25mm Single Sided 1 Layer PCB Car Audio HASL Washing Machine

... chip size: 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) Maximum BGA size: 74x74mm BGA ball pitch: 1.00mm (minimum), 3.00mm (maximum) BGA ball diameter: 0.40mm (minimum), 1.00mm (maximum) QFP lead pitch: 0.38mm (minimu...

Shenzhen Senyan Circuit Co., Ltd.
Guangdong,China

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1.6mm 2 Layers PCB 0.5 Ounce To 6 Ounce 0.25mm

... chip size: 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) Maximum BGA size: 74x74mm BGA ball pitch: 1.00mm (minimum), 3.00mm (maximum) BGA ball diameter: 0.40mm (minimum), 1.00mm (maximum) QFP lead pitch: 0.38mm (minimu...

Shenzhen Senyan Circuit Co., Ltd.
Guangdong,China

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SMT Prototype 2 Layers PCB 0.5 To 6oz 0.25mm OEM

... chip size: 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) Maximum BGA size: 74x74mm BGA ball pitch: 1.00mm (minimum), 3.00mm (maximum) BGA ball diameter: 0.40mm (minimum), 1.00mm (maximum) QFP lead pitch: 0.38mm (minimu...

Shenzhen Senyan Circuit Co., Ltd.
Guangdong,China

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HASL-F 2 Sided PCB

... chip size: 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) Maximum BGA size: 74x74mm BGA ball pitch: 1.00mm (minimum), 3.00mm (maximum) BGA ball diameter: 0.40mm (minimum), 1.00mm (maximum) QFP lead pitch: 0.38mm (minimu...

Shenzhen Senyan Circuit Co., Ltd.
Guangdong,China

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2 To 16 Layer Double Side Prototype PCB

... chip size: 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) Maximum BGA size: 74x74mm BGA ball pitch: 1.00mm (minimum), 3.00mm (maximum) BGA ball diameter: 0.40mm (minimum), 1.00mm (maximum) QFP lead pitch: 0.38mm (minimu...

Shenzhen Senyan Circuit Co., Ltd.
Guangdong,China

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ISO9001 700x460mm Turnkey PCB Assembly Prototype PCBA For Household Appliances

... chip size: 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) Maximum BGA size: 74x74mm BGA ball pitch: 1.00mm (minimum), 3.00mm (maximum) BGA ball diameter: 0.40mm (minimum), 1.00mm (maximum) QFP lead pitch: 0.38mm (minimu...

Guangzhou Highleap Electronic Co.,Ltd.
China

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1200x500mm Electronics PCB Components Assembly SMD PCB Industrial Controller High End

...: 0.25mm Minimum chip size: 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) Maximum BGA size: 74x74mm BGA ball pitch: 1.00mm (minimum), 3.00mm (maximum) BGA ball diameter: 0.40mm (minimum), 1.00mm (maximum) QFP lead pitch...

Guangzhou Highleap Electronic Co.,Ltd.
China

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Ni Au 3u'' 5u'' FR4 PCB Board 3OZ 70um Copper Electronics Circuit Board

...double-sided SMT/PTH Yes Large parts on both sides, BGA on both sides Yes Smallest Chips size 0201 Min BGA and Micro BGA pitch and ball counts 0.008 in. (0.2mm) pitch, ball count greater than 1000 Min Leaded...

Abis Circuits Co., Ltd.
Guangdong,China

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SMOBC HASL ENIG 1.6mm Multi Layer PCB Board Green Immersion Gold Hdi Tg150

...SMT/PTH Yes Large parts on both sides, BGA on both sides Yes Smallest Chips size 0201 Min BGA and Micro BGA pitch and ball counts 0.008 in. (0.2mm) pitch, ball count greater than 1000 Min Leaded parts pitch ...

Abis Circuits Co., Ltd.
Guangdong,China

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3mil ENIG HASL OSP Rigid Flexible PCB 350um Mobile Phone PCB Prototype

...double-sided SMT/PTH Yes Large parts on both sides, BGA on both sides Yes Smallest Chips size 0201 Min BGA and Micro BGA pitch and ball counts 0.008 in. (0.2mm) pitch, ball count greater than 1000 Min Leaded...

Abis Circuits Co., Ltd.
Guangdong,China

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LPI Green Multilayer PCB Board FR4 TG135 TG150 TG170 35um HASL With Peelable Mask

...double-sided SMT/PTH Yes Large parts on both sides, BGA on both sides Yes Smallest Chips size 0201 Min BGA and Micro BGA pitch and ball counts 0.008 in. (0.2mm) pitch, ball count greater than 1000 Min Leaded...

Abis Circuits Co., Ltd.
Guangdong,China

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Buried Blind Vias HDI PCB Board 175um LPI Tin Sn For Mobile Phone

...Single and double-sided SMT/PTH Yes Large parts on both sides, BGA on both sides Yes Smallest Chips size 0201 Min BGA and Micro BGA pitch and ball counts 0.008 in. (0.2mm) pitch, ball count greater than 1000...

Abis Circuits Co., Ltd.
Guangdong,China

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350um LPI SMT PTH PCB Board Assembly ISO14001 PCBA Electronic Pcb Assembly

...SMT/PTH Yes Large parts on both sides, BGA on both sides Yes Smallest Chips size 0201 Min BGA and Micro BGA pitch and ball counts 0.008 in. (0.2mm) pitch, ball count greater than 1000 Min Leaded parts pitch ...

Abis Circuits Co., Ltd.
Guangdong,China

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ENIG 350um OSP PCB Board Assembly 3mil Multilayer Fr4 PCB Motherboard

.../PTH Yes Large parts on both sides, BGA on both sides Yes Smallest Chips size 0201 Min BGA and Micro BGA pitch and ball counts 0.008 in. (0.2mm) pitch, ball count greater than 1000 Min Leaded parts pitch 0.0...

Abis Circuits Co., Ltd.
Guangdong,China

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175um HASL EMS PCB Board Assembly ENIG SMT PCB Assembly Service

... SMT/PTH Yes Large parts on both sides, BGA on both sides Yes Smallest Chips size 0201 Min BGA and Micro BGA pitch and ball counts 0.008 in. (0.2mm) pitch, ball count greater than 1000 Min Leaded parts pitch...

Abis Circuits Co., Ltd.
Guangdong,China

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3mil LPI 175um OSP Turnkey PCB Assembly Smd Electronics PTEF

...double-sided SMT/PTH Yes Large parts on both sides, BGA on both sides Yes Smallest Chips size 0201 Min BGA and Micro BGA pitch and ball counts 0.008 in. (0.2mm) pitch, ball count greater than 1000 Min Leaded...

Abis Circuits Co., Ltd.
Guangdong,China

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SMOBC HASL LPI 17um Prototype Aluminum PCB ISO9001 Prototype Pcb Fabrication

...SMT / PTH Yes Large parts on both sides, BGA on both sides Yes Smallest Chips size 0201 Min BGA and Micro BGA pitch and ball counts 0.008 in. (0.2mm) pitch, ball count greater than 1000 Min Leaded parts pitc...

Abis Circuits Co., Ltd.
Guangdong,China

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T-937 Infrared Reflow Oven

T-937 Infrared IC Heater Reflow Oven Features a. This oven solder leadfree paste very well. b. This oven can connect with PC, easy to input/set/transmit/adjust/save/manage wave data. c. Many kinds wave input st...

Wuxi Rizhixin Industrial Equipment Co., Ltd.
Jiangsu,China

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PID 9KW SMT Reflow Oven Machine 1500mm/Min Conveyor 7 Zone RF-700 I

Lead Free 7 Zone Reflow Oven SMT Production Machine RF-700 I Features 1. Even temperature and high heat compensation efficiency, especially suitable for soldering of BGA CSP components. 2. The patent wind wheel...

UNIQUE AUTOMATION LIMITED
China

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CE PLC Lead Free Reflow Oven Machine 600mm Cooling Zone RF-H800I RF-H1010I

...-H800I RF-H1010I Features · Even temperature and high heat compensation efficiency, especially suitable for soldering of BGA CSP components. · The patent wind wheel design can ensure wind speed windspeed can...

UNIQUE AUTOMATION LIMITED
China

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Bga Solder Ball

Total 1197 products for bga solder ball Manufacture & Suppliers