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..., SME-6100 PCBA deflux DI water in line wash system. SME-6100 mainly used to clean water-soluble solder paste and solder balls on PCBA. Functional section: Pre...
... flux residues in the electronics industry. The water-based cleaning machine is used for spray cleaning to remove surface flux residues, solder balls, solder paste, dust,...
... flux residues in the electronics industry. The water-based cleaning machine is used for spray cleaning to remove surface flux residues, solder balls, solder paste, dust,...
... flux residues in the electronics industry. The water-based cleaning machine is used for spray cleaning to remove surface flux residues, solder balls, solder paste, dust, impurities,...
... flux residues in the electronics industry. The water-based cleaning machine is used for spray cleaning to remove surface flux residues, solder balls, solder paste,...
... flux residues in the electronics industry. The water-based cleaning machine is used for spray cleaning to remove surface flux residues, solder balls, solder paste...
... flux residues in the electronics industry. The water-based cleaning machine is used for spray cleaning to remove surface flux residues, solder balls, solder paste, dust, impurities, oil and other pollutants...
..., SMTech machines, and Yamaha machines. SMT Understencil Wiping Rolls are used to remove residual solder paste from the bottom side of PC Board stencils. Using Stencil Wiping Rolls prevents smearing, bridgin...
Factory directly supply PCB assembly machinery HWGC HW-T8-80F SMT SMD pick and place machine with 10 cameras Based on 6 mounting heads +8 cameras+64 feeder positions+ Panasonic Servo motor+guide screw, the posi...
...) package, and is suitable for applications such as telecommunication, storage, and data processing. Features: • 324-pin BGA package • 28K logic elements • Up to 18,432 Kbits of embedded memory • Up to 576Kb...
..., and function testing. We have no minimal qty for your new order. We can support you from turkey to mass volume. ---BGA ball diameter: 0.12mm; BGA pitch: 0.35mm-1.27; QFN/QFP fine pitch:0.35mm ---01005 chip...
... In-circuit Test Function Test Min Chip 0201 chip Glue,Burn-in Conformal Coating Fine-pitch 0.20mm BGA Re-work BGA ball size 0.28mm Technology Involved: H 高 ◆SMT+ICT+THT...
... In-circuit Test Function Test Min Chip 0201 chip Glue,Burn-in Conformal Coating Fine-pitch 0.20mm BGA Re-work BGA ball size 0.28mm Technology Involved: H 高 ◆SMT+ICT+THT...
... In-circuit Test Function Test Min Chip 0201 chip Glue,Burn-in Conformal Coating Fine-pitch 0.20mm BGA Re-work BGA ball size 0.28mm Technology Involved: H 高 ◆SMT...
... In-circuit Test Function Test Min Chip 0201 chip Glue,Burn-in Conformal Coating Fine-pitch 0.20mm BGA Re-work BGA ball size 0.28mm H 高 ◆SMT+ICT+THT+FT ◆SMT+ICT+THT+Harness+Assembly+FT ◆SMT machine(for...
... In-circuit Test Function Test Min Chip 0201 chip Glue,Burn-in Conformal Coating Fine-pitch 0.20mm BGA Re-work BGA ball size 0.28mm Technology Involved: H 高 ◆SMT+ICT+THT+FT ◆SMT+ICT+THT+Harness+Assembly+FT ◆...
... In-circuit Test Function Test Min Chip 0201 chip Glue,Burn-in Conformal Coating Fine-pitch 0.20mm BGA Re-work BGA ball size 0.28mm Technology Involved: H 高 ◆SMT+ICT+THT+FT ◆SMT+ICT+THT+Harness+Assembly+FT ◆...
... In-circuit Test Function Test Min Chip 0201 chip Glue,Burn-in Conformal Coating Fine-pitch 0.20mm BGA Re-work BGA ball size 0.28mm Technology Involved: H 高 ◆SMT+ICT+THT+FT ◆SMT+ICT+THT+Harness+Assembly+FT ◆...
... In-circuit Test Function Test Min Chip 0201 chip Glue,Burn-in Conformal Coating Fine-pitch 0.20mm BGA Re-work BGA ball size 0.28mm Technology Involved: H 高 ◆SMT+ICT+THT+FT ◆SMT+ICT+THT+Harness+Assembly+FT ◆...
... In-circuit Test Function Test Min Chip 0201 chip Glue,Burn-in Conformal Coating Fine-pitch 0.20mm BGA Re-work BGA ball size 0.28mm Technology Involved: H 高 ◆SMT+ICT+THT+FT ◆SMT+ICT+THT+Harness+Assembly+FT ◆...